Group 1: R&D Investment and Focus - The company invested CNY 52.21 million in R&D during the reporting period, a year-on-year increase of 24.60% [1] - Total R&D expenses for the first three quarters reached CNY 157.97 million, reflecting a commitment to technological innovation [1] - Future R&D efforts will focus on enhancing core technology capabilities and expanding product lines in the storage chip sector [2] Group 2: Market Performance and Strategy - The company's storage product line experienced growth in shipment volume, primarily driven by SLC NAND products [1] - Revenue growth is attributed to the recovery of the storage market and increased demand from major operators promoting FTTR solutions [2] - The company aims to increase market share by focusing on leading clients across various downstream application fields [2] Group 3: New Product Development - The company is advancing the development of SLC NAND Flash products based on 2xnm process technology, with significant progress on 1xnm products [2] - Ongoing R&D for NOR Flash products targets mid-to-high capacity ranges (64Mb-1Gb) to meet diverse customer needs [2] - The company is also developing DRAM products, including LPDDR4x, to enhance product diversity [2] Group 4: Strategic Expansion into New Technologies - The company is exploring integrated technology fields, including Wi-Fi 7, to diversify its product offerings [2] - A new subsidiary, Yixin Tonggan, has been established to focus on Wi-Fi 7 chip development, leveraging experienced R&D teams [2] - Investment in Shanghai Lishan aims to enhance capabilities in GPU chip design, aligning with the company's core business [2]
东芯股份(688110) - 东芯半导体股份有限公司投资者关系活动记录表(2024年11月8日业绩说明会)