Dosilicon(SH:688110)2024-11-18 10:34Group 1: Company Overview and Recent Developments - The company introduced its recent operational status, highlighting the advantages and disadvantages of IDM and Fabless models, with a focus on cost pressures and capital investment risks associated with IDM [1] - The company is pursuing Wi-Fi 7 as a new R&D project due to the expanding market for Wi-Fi chips, driven by high bandwidth, security, low latency, and the increasing demand for reliable wireless communication in IoT devices [2] Group 2: Market Position and Product Strategy - The company aims to maintain its leading position in the SLC NAND market in mainland China by increasing product offerings and enhancing market share [2] - The company is actively promoting mid-to-high capacity NOR products and expanding its niche DRAM product line to capture more market share [2] - The competitive landscape for SLC NAND is shifting, with major players like Samsung exiting the market, providing the company an opportunity to increase its market share [2] Group 3: Cost and Pricing Insights - The company anticipates stable foundry prices in the second half of the year as capacity constraints ease, indicating a steady pricing environment [2]