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泓禧科技(871857) - 投资者关系活动记录表

Group 1: Investor Relations Activities - The company held an online investor reception day on November 28, 2024, allowing investors to participate via a dedicated platform [2]. - The reception was attended by investors and company representatives, including the board secretary and financial officer [3]. Group 2: Company Strategy and Market Position - The company aligns with the national Western Development policy, benefiting from support in innovation and industrial upgrades [3]. - The company maintains a stable dividend policy, considering operational needs and financial conditions for annual dividend plans [4]. - The recent change in controlling shareholder due to a corporate split does not affect the company's development strategy [4]. Group 3: Competitive Advantages and Future Directions - The company has competitive advantages in high-frequency, high-speed, intelligent, miniaturized, and customized products, particularly in the AI PC sector [4]. - Investments in subsidiaries in regions like Henan and Myanmar aim to reduce production costs and expand capacity, while also facing risks such as market competition and foreign operations [5]. - The integration of AI technology is expected to revitalize the PC industry, with new products driving growth [6]. Group 4: Financial Management and Risks - The company has implemented measures to manage foreign exchange risks, including real-time tracking of currency fluctuations and using forward exchange contracts [7]. - Asset pledges for bank loans are part of normal operations, aimed at ensuring stable business continuity [8]. - The company has seen a significant increase in construction projects and long-term expenses, indicating expansion plans [9]. Group 5: Cash Flow and Investment Strategies - Operating cash flow increased due to higher revenue and accounts receivable collections, while investment cash flow decreased due to reduced idle fund redemptions [13]. - The company is not a direct supplier to Huawei but is focused on global expansion in high-precision electronic components [10].