Kunshan Dongwei Technology (SH:688700)2024-12-05 07:35Group 1: Market Position and Equipment - The company has established a market share of over 50% in VCP electroplating equipment [5] - The company is the only global enterprise capable of large-scale production of composite fluid negative electrode materials for water electroplating equipment [5] - The latest generation of photovoltaic copper plating equipment has entered trial production with multiple clients, achieving recognized plating effects [4] Group 2: Order and Production Insights - PCB orders in 2024 have shown significant improvement, exceeding the peak levels of 2021 [4][6] - The company has received sales orders for magnetron sputtering equipment, which enhances production efficiency and reduces costs [4] - The Changshu production base has officially commenced operations, focusing on general hardware electroplating equipment [4] Group 3: Future Outlook and Technology Development - The company is optimistic about the future development of composite fluid technology, anticipating rapid penetration once the industry matures [5] - The company has been actively developing composite copper foil equipment since 2017, with significant technological advancements made by 2022 [6] - The dual-sided clamping electroplating technology is expected to become the mainstream route, improving product yield rates [6][7]