巴克莱：美国半导体与半导体资本设备：构建规模扩张架构

Equity Research 25 June 2025 U.S. Semiconductors & Semiconductor Capital Equipment Laying Out the Scale-Up Architecture Landscape Interconnect is more critical than ever for the success of XPU efforts, and this is no more prevalent than in scale-up designs where dominance is being fought today amongst three factions (UALink, Scale Up Ethernet, NVLink) with major implications for the future of AI. We appreciate your 5-star vote in the 2025 Extel All-America Research Survey in the Semiconductors & Semiconduct ...