2025-08-18 02:52Summary of Key Points from the Conference Call Industry Overview - Industry Focus: The conference call primarily discusses the semiconductor industry, specifically the advanced packaging segment and the adoption of chiplet architectures. - Key Technologies: Emphasis on CoWoS (Chip-on-Wafer-on-Substrate) and FOCoS (Fan-Out Chip on Substrate) technologies as critical for advanced packaging solutions. Core Insights and Arguments - Chiplet Adoption: The adoption of chiplet architectures is accelerating, particularly as the industry transitions to 2nm nodes. Projections indicate chiplet penetration for nodes 5nm and below will reach 21% in 2025, 30% in 2026, and 37% in 2027, with 2nm node adoption expected to reach 57% by 2027E [1][40]. - Cost and Yield Improvements: Chiplet architectures can significantly lower manufacturing costs by splitting larger dies into smaller ones, improving yield rates. For instance, manufacturing costs can be reduced by 79.2% when transitioning from a single large die to multiple smaller chiplets [1][24][36]. - Growing Demand for CoWoS: The increasing chiplet penetration is expected to drive demand for CoWoS technology, which facilitates high-speed die-to-die interconnections. This demand is projected to grow at a CAGR of 71% for capacity and 63% for shipments from 2025 to 2027E [1][54][55]. Company-Specific Insights - TSMC (2330.TW): - TSMC is a leader in advanced semiconductor packaging, particularly through its CoWoS technology, which is essential for AI and HPC applications. The company is expected to see significant revenue growth from CoWoS, with projections indicating it will account for 8.3% to 15.3% of TSMC's revenue from 2025 to 2027E [1][66]. - TSMC's CoWoS capacity is forecasted to reach 75k, 120k, and 170k in 2025, 2026, and 2027, respectively, reflecting aggressive capacity expansions to meet demand [1][66]. - ASE (3711.TW): - ASE is gaining traction with its FOCoS technology, which is a cost-effective alternative to CoWoS, typically priced at half the cost. ASE's revenue from advanced packaging is expected to grow by 15% and 11% YoY in 2025 and 2026, respectively [1][67][69]. - All Ring (6187.TWO): - All Ring is positioned to benefit from the advanced packaging trend, with expectations of revenue growth of 42% and 18% in 2025 and 2026, driven by CoWoS capacity expansion and new opportunities in CPO (Co-Packaged Optics) [1][71]. - GPTC (3131.TWO): - GPTC is a key supplier of wet processing equipment for advanced packaging, with a market share of approximately 50% at TSMC. The company is expected to see revenue growth of 18.7% CAGR from 2024 to 2027, driven by the complexity of advanced packaging technologies [1][74][90]. Additional Important Insights - Market Dynamics: The report highlights the shift from traditional packaging methods to advanced solutions like CoWoS and FOCoS, indicating a broader market trend towards higher integration and performance in semiconductor designs [1][53]. - Total Addressable Market (TAM): The total addressable market for CoWoS is projected to reach US$27.8 billion by 2027, growing at a CAGR of 65% from 2025 to 2027E [1][55][60]. - Risks and Challenges: Key risks include potential deterioration in end-demand, competition, and execution challenges that could impact profitability and market share for the companies involved [1][80][85][89]. This summary encapsulates the critical insights and projections discussed in the conference call, focusing on the semiconductor industry's evolution towards advanced packaging technologies and the implications for key players in the market.