对话产业链大佬 - 详解高阶HDI的工艺流程与核心生产设备

Summary of Key Points from the Conference Call Industry Overview - The conference call focuses on the PCB (Printed Circuit Board) industry, particularly the high-density interconnect (HDI) and high multilayer boards due to their complex designs and high manufacturing difficulty, leading to limited market supply and higher profit margins [1][2][3]. Core Insights and Arguments - AI Demand Impact: The demand for AI computing servers is significantly driving the growth of the PCB industry, especially in high-end processes. The primary types of PCBs used include high multilayer boards and high-density interconnect (HDI) boards, which involve complex designs that exceed traditional PCBs [2][3]. - Manufacturing Complexity: High-density HDI boards require multiple blind hole processing steps, with each step involving chemical copper deposition, electroplating, and imaging, leading to equipment usage that is over five times that of standard HDI boards [1][4]. - Exposure Process Challenges: The exposure process for high-density HDI boards faces challenges in resolution and alignment accuracy, with requirements for exposure machines to achieve resolutions below 40 micrometers due to the finer lines used in AI boards [5][6]. - Pressing Process Requirements: The pressing process for high-density HDI boards requires uniform temperature control and the use of thermal oil for heat transfer, with pressing temperatures exceeding 250°C for advanced materials [7][8]. - Drilling Precision: The drilling stage is critical, with AI applications requiring blind hole diameters of 60-70 micrometers, necessitating high precision in drilling locations to avoid circuit failures [9][10]. Additional Important Content - Equipment Configuration: For a production line capable of 50,000 square meters of high-density HDI per month, specific equipment configurations are required, including approximately 18 exposure machines and 10 pressing machines [17][18]. - Market Trends: The PCB industry is experiencing an upward expansion trend, with leading manufacturers actively increasing production capacity to meet the growing demand from AI clients [33][34]. - Supplier Landscape: Key suppliers in the exposure segment include Japanese and American brands known for their resolution and stability, while domestic brands are gradually improving but still lag in experience and reliability [22][23]. - Technological Upgrades: The transition from materials like M7 to M9 presents new challenges for laser drilling, impacting efficiency and requiring further validation [13][26]. This summary encapsulates the critical aspects of the conference call, highlighting the complexities and advancements within the PCB industry driven by AI demand and technological innovations.