Summary of Key Points from the Conference Call Industry Overview - The conference call focuses on the Asia-Pacific Technology sector, specifically Copper Clad Laminate (CCL) and Printed Circuit Board (PCB) industries, with a particular emphasis on companies like Elite Material (EMC), Taiwan Union Technology Corporation (TUC), Unimicron, and Shengyi. Core Insights and Arguments 1. CCL and PCB Market Dynamics - Continuous specification upgrades are observed in both CCL and PCB sectors, with a notable transition in AWS products expected to last until 1Q26. The upgrade in CCL materials, particularly in copper foil, is highlighted as a significant trend [1][2][3]. 2. EMC's Position - EMC is positioned as a prime beneficiary of the adoption of M9-grade CCL, particularly for mid-plane applications with 40+ layers of PCB. The demand for CCL is expected to increase due to additional PCB requirements from CX9 networking cards and CPX GPUs [2]. 3. TUC's Outlook - TUC is anticipated to benefit from the mainstream adoption of M8-grade CCL in AI servers by 2026. The company is also expected to see a mix improvement in low earth orbit (LEO) applications, transitioning from M6 to M7 materials [3]. 4. Unimicron's Financial Projections - Unimicron's estimates for 2026-27 EPS have been raised by 2-6% due to the positive impact of the VR NVL144 CPX. The price objective has been adjusted to NT$110 from NT$105, maintaining a 13.5x 2026E P/E [4][9]. 5. Shengyi's Revenue Growth - Shengyi has increased its revenue exposure to AI and infrastructure-related business to approximately 35%. The price objective has been raised to CNY32 from CNY27.5, with a higher P/E multiple of 18x [5][21]. Additional Important Insights 1. Market Competition - The competitive landscape for CCL is less crowded compared to PCB, which is a favorable condition for companies like EMC and TUC [1]. 2. Revenue Stagnation in Certain Segments - Despite growth in AI-related business, Shengyi still derives about 40% of its revenue from consumer electronics and industrial verticals, which are experiencing stagnant demand [5]. 3. Valuation Adjustments - The valuation multiples for Unimicron and Shengyi have been adjusted based on their respective market positions and growth prospects, reflecting a strategic response to evolving market conditions [9][10]. 4. Risks and Challenges - Potential risks include competition in high-end CCL, fluctuations in raw material prices, and execution challenges that could impact market share and business traction for these companies [20][24][26]. 5. Analyst Ratings - The report includes various investment ratings for the companies discussed, with EMC and TUC rated as Buy, while Unimicron and Shengyi are underperforming relative to their peers [19][30]. This summary encapsulates the key points discussed in the conference call, providing insights into the current state and future outlook of the CCL and PCB industries, along with specific company analyses.
CCL_PCB_ 持续关注规格迁移;维持电子材料(EMC)买入评级,目标价调整