晶盛机电(300316) - 300316晶盛机电投资者关系管理信息20251016

Group 1: Semiconductor Substrate Materials - The company has established a leading position in silicon carbide (SiC) substrate materials, with capabilities in 8-inch and 12-inch SiC crystal growth technology [2] - The first 12-inch SiC substrate processing pilot line was launched on September 26, 2025, marking a significant advancement in the company's production capabilities [2][3] - The company is actively expanding its SiC substrate production capacity, with a project in Shangyu aiming for an annual output of 300,000 pieces and another in Malaysia for 8-inch SiC substrates [4] Group 2: Semiconductor Equipment and Technology - The company has achieved domestic production of semiconductor equipment for 8-12 inch silicon wafers and is extending its reach into chip manufacturing and advanced packaging [5] - In the compound semiconductor equipment sector, the company focuses on third-generation semiconductor SiC equipment, successfully overcoming several core technology challenges [5] - As of June 30, 2025, the company has unfulfilled contracts for integrated circuit and compound semiconductor equipment exceeding 3.7 billion yuan (including tax) [6]