算力PCB行业跟踪系列 - AI产品向载板工艺和M9材料升级

Summary of PCB Industry Conference Call Industry Overview - The PCB market is undergoing continuous iteration, reflected in improvements in embedded capacitors, Cover P solutions, and upstream materials like copper foil and fabric, with a strong market performance since Q2 indicating sustained industry prosperity [1][3] - Domestic CCL companies are increasing their participation, accelerating domestic substitution and gaining market share, enhancing confidence in the mainland supply chain [1][5] - The M9 material, although not yet in mass production, shows significant potential for enhancement in server ESP applications [1][4] Key Trends and Developments - Liquid cooling technology plays a crucial role in enhancing AI computing power by effectively addressing heat dissipation issues, thereby improving system stability and performance [1][6] - The PCB industry is evolving towards low-loss and high-precision standards, with a transition from M6 to M9 materials, increasing circuit complexity and layer counts, and upgrading to class carrier technologies and PDF materials [1][10] - The high-end copper-clad laminate market is expected to reach a demand of 100 billion yuan by 2026, with copper-clad laminate costs accounting for about half of this, indicating a substantial market opportunity [1][12][13] Company Insights - Leading companies in the domestic market include Xingsen and Shennan, which are at the forefront of carrier board technology, while other listed companies are relatively late entrants [4] - The M9 material is highlighted as a key focus for future development, with its low loss characteristics driving the high-end product trend and promoting domestic substitution of critical equipment and materials [1][7] Market Dynamics - The domestic PCB industry is experiencing rapid increases in domestic substitution rates, with a shift from reliance on Taiwanese enterprises to a growing number of capable domestic CCL companies [5] - The upgrade of materials is not only advancing the development of copper-clad laminate manufacturers but also driving the overall upgrade of the chemical and upstream industries, necessitating advanced raw materials and new equipment [16] Future Outlook - The future development of narrow board technology is expected to focus on further improving precision and integration, potentially replacing existing HDI technology [18][19] - High-end PCB products are projected to have a broad market application outlook, with companies like Shengyi Technology continuously enhancing product quality to meet market demands [20] - Upcoming projects worth monitoring include the transition from HDR to narrow board technology and the development of interposers using silicon carbide, which may lead to new market opportunities [22] Conclusion - The PCB industry is poised for significant growth driven by technological advancements, material upgrades, and increasing domestic capabilities, presenting numerous investment opportunities in the coming years [14][21]