江波龙(301308) - 2025年12月2日投资者关系活动记录表

Group 1: Market Trends and Pricing - The demand for CSP in high-performance TLC eSSD and QLC eSSD is expected to rise due to AI applications, while HDD supply remains tight, supporting a continued increase in NAND Flash prices in Q4 [2][3] - Major manufacturers are maintaining a cautious capacity expansion strategy, which may limit the contribution to bit output growth in 2026 due to the lag in capacity construction cycles [2] Group 2: Supply Chain and Partnerships - The company has established long-term direct cooperation with major global storage wafer manufacturers, providing a competitive edge in the supply chain [3] - Supplier information is disclosed in public documents such as the prospectus [3] Group 3: Technology and Product Development - The company's self-developed controller chip technology offers significant performance and power consumption advantages, utilizing advanced foundry processes and proprietary firmware algorithms [3] - The company has launched several cutting-edge high-performance storage products, including MRDIMM and CXL2.0 memory expansion modules, and is focused on market demand for future product development [3] Group 4: Clientele and Market Engagement - The company actively participates in technology and new product bidding for major clients, with enterprise storage products integrated into the supply chains of leading internet companies, including telecom operators and server manufacturers [3] Group 5: Disclosure Compliance - The activity does not involve any undisclosed significant information [3]