转型材料：更凉爽的芯片-破解 AI 散热瓶颈-Transition Materials _Cooler Chips - Addressing the AI Thermal Bottleneck

ab 4 December 2025 Powered by YES UBS Evidence Lab Global Research Transition Materials Cooler Chips - Addressing the AI Thermal Bottleneck Al Compute Is Straining Thermal and Sustainability Limits Al accelerators are now operating at 700-1,200 W per device, pushing both cooling systems and packaging materials toward their physical limits. The recent CME datacentre outage - triggered by overheating - underscores how narrow thermal margins have become. This challenge also intersects with the sustainability p ...