Jinfu Technology(SZ:300128)2025-12-17 10:04Group 1: Liquid Cooling Business Overview - The core product of the current liquid cooling business is the external cold plate liquid cooling module, primarily used for high-power AI chips in HGX server structures, achieving stable shipments in high-density computing environments [1] - The company positions itself as a machining and manufacturing provider for core components of liquid cooling modules, focusing on high-precision processing and welding, while not engaging in system integration [2] - The company has completed a new round of capacity expansion, with production expected to commence before the Spring Festival, and has achieved millions in shipments of cold plates and related products [2] Group 2: Technical Differentiation and Market Position - The company's cold plate solution is compact and closely aligned with GPU layouts, offering advantages in space utilization and deployment flexibility compared to larger heat plates [2] - The company is advancing microchannel liquid cooling technology, which enhances heat transfer efficiency for next-generation high-power chips, currently in the validation and sampling stage [3] - The company has engaged in preliminary testing for the Rubin Ultra platform, which is expected to transition from module-level to package-level liquid cooling, requiring higher precision and reliability [4] Group 3: Competitive Advantage and Business Structure - The company's core competitiveness lies in its deep integration with Taiwan's high-end semiconductor and server supply chain, allowing early participation in new technology validations [5] - Besides the liquid cooling business, the company maintains a stable traditional metal processing business while exploring innovative material and structural projects, which currently have a smaller scale [6] - Overall, the traditional business provides stability, the innovative projects offer flexibility, and the liquid cooling business is the primary growth focus [7]