江波龙(301308) - 2025年12月15日-19日投资者关系活动记录表

Group 1: Market Demand and Supply Dynamics - The demand for high-performance TLC eSSD and QLC eSSD is driven by the continuous application of AI technology in cloud services, coupled with a shortage of HDD supply, leading to a surge in NAND Flash demand [3] - Major manufacturers are maintaining a cautious capacity expansion strategy, which may limit the incremental contribution to output in 2026 due to the lag in capacity construction [3] Group 2: Supply Chain and Inventory Management - The company has established long-term direct cooperation with major global storage wafer manufacturers, ensuring a competitive advantage in the supply chain [3] - Long-term supply agreements (LTA) and memorandums of understanding (MOU) are in place to ensure a stable supply of storage wafers [3] Group 3: Profitability and Business Model - The production cycle from wafer procurement to memory sales means that rising wafer prices will positively impact the company's gross margin [3] - The company has made significant breakthroughs in high-end storage, overseas business, and self-developed main control chips, which will drive profitability growth [3] Group 4: TCM Model and Future Prospects - The TCM model, which integrates the entire supply chain from chip development to packaging, is gaining recognition from major Tier 1 customers [3] - The TCM model's customer acceptance is expected to increase during periods of rising storage prices, with ongoing acceleration in its implementation [4]