日本 SEMICON 先进封装基板研讨会报告_ Report on SEMICON Japan Advanced Package Substrates seminar

Summary of Key Points from the Conference Call Industry Overview - The conference focused on the Electronic Components Sector, specifically discussing advancements in Advanced Package Substrates at the SEMICON Japan seminar held on December 17. Core Company Insights Ibiden - Trend in Advanced Packaging: Ibiden anticipates a continued trend towards larger and multi-layered substrate packaging as chiplets gain popularity. Warpage management is crucial for maintaining and improving yields [1][6]. - Demand for Embedded Components: There is an increasing demand from customers to embed core components like inductors and capacitors into copper clad laminates (CCLs) as substrate sizes grow [1][6]. - Core Structure Changes: Ibiden is considering shifting from a single core structure to a multi-core structure to enhance embedded component capabilities [1][9]. - New Ono Plant: Mass production is set to begin in October 2025, focusing on productivity, quality innovation, and sustainability. The plant will utilize automated processes for inspections and transport [1][9]. - Package Size Expansion: The demand for larger interposer reticles is increasing, driven by AI and high-performance computing (HPC) applications, which raises concerns about warpage due to coefficient of thermal expansion (CTE) mismatches [1][9]. Resonac - Challenges with Larger Packages: Resonac highlighted the need to address warping and crack resistance as package sizes increase due to AI and HPC demands [1][8]. - Material Development: The company is focused on developing materials that can withstand increased stress and improve alignment precision in larger packages [1][10]. - Collaborative Platform JOINT3: Launched in August 2025, this platform aims to facilitate the development of large interposers, involving 27 companies with a total project cost of ¥26 billion [1][10]. Absolics - 3D Heterogeneous Integration (3DHI): Absolics discussed the complexity of packaging structures and the expectation that chip configurations will evolve to include more than 10,000 bumps per mm² and 1.2 trillion transistors by 2030 [1][12]. - Glass as a Preferred Material: The company views glass as a leading candidate for substrate materials due to its adjustable electrical properties and CTE, despite challenges like breakage and integration difficulties [1][12]. - Roadmap for Development: Absolics presented a roadmap for component-embedded glass core substrates, aiming for process optimization and yield improvement by the end of 2025 [1][12]. Additional Insights - Cutting Techniques: Various companies are exploring laser-dicer cutting methods for glass core substrates, as traditional grinding methods become less feasible with increasing substrate thickness [2][6]. - Industry Challenges: The pressing process for through-holes is progressing, but stress during substrate cutting remains a significant issue [2][6]. - Future Prototypes: Some manufacturers are targeting mass production of glass core substrates by 2028, indicating a long-term commitment to innovation in this area [2][6]. This summary encapsulates the key points discussed during the conference, highlighting the ongoing advancements and challenges within the electronic components sector, particularly in the realm of advanced packaging technologies.