江波龙(301308) - 2025年12月29日投资者关系活动记录表

Group 1: Product Innovations - The company's new product, mSSD, integrates multiple components into a single package, offering significant cost advantages over traditional SSDs [3] - mSSD provides TB-level capacities and meets high-performance standards for PCIe interfaces, making it suitable for diverse storage applications [3] - The innovative design of mSSD includes a tool-free expansion feature, enhancing compatibility and user experience [3] Group 2: Market Opportunities - The market for UFS4.1 products is expanding, especially as major competitors like Micron exit the consumer storage market [3][4] - The company is one of the few capable of developing UFS4.1 products at the chip level, with its offerings recognized by major Tier 1 clients [3] - The demand for NAND Flash is expected to surge due to AI applications and a shift from HDD to SSD among cloud service providers [4] Group 3: Pricing Trends - Predictions indicate that prices for Mobile eMMC/UFS may rise by 25%-30% in Q1 2026, with LPDDR4X/5X expected to increase by 30%-35% [4] - The price of PC DDR5/LPDDR5X is also projected to rise by 30%-35%, while cSSD prices may increase by 25%-30% [4] Group 4: Future Developments - The company plans to design high-performance controller chips for UFS, eMMC, SD cards, and PCIe SSDs, enhancing its product competitiveness [4] - The company will adopt a Fabless model for its chip architecture and firmware development [4]

Shenzhen Longsys Electronics -江波龙(301308) - 2025年12月29日投资者关系活动记录表 - Reportify