2026-01-04 15:35Summary of Key Points from the Conference Call Industry Overview - The conference call focuses on the 2026 Electronic Industry Predictions, particularly in the cloud computing and AI sectors, highlighting significant trends and developments expected in the coming years [2][3][4]. Key Insights and Arguments Cloud Computing Sector - The domestic cloud computing sector, especially domestic computing power, is anticipated to experience substantial growth by the end of 2026, with major wafer fabs expected to release ample capacity, alleviating previous supply constraints [2][3]. - ByteDance's data consumption has shown remarkable growth, increasing from approximately 15-16 trillion in May 2025 to over 50 trillion by December 2025, indicating strong demand for domestic computing power [2]. - The demand for domestic computing power is projected to exceed 100 trillion by mid-2026, setting a solid foundation for the performance of domestic computing companies [2][3]. - Leading companies like Cambricon and Hygon are expected to dominate in capacity supply and local government bidding, benefiting from the rising demand for inference chips, with ASIC chips likely to become as significant as GPU chips [2][3]. - The domestic CS market is under increasing pressure for localization, with local suppliers like Shenghe Jingwei expected to capture more market share in supercomputing nodes [2][3]. Edge Computing Sector - The edge computing (SOC) sector is set to benefit from the AI innovation wave, with smart hardware products such as glasses and robots expected to see significant development opportunities [4]. - The emergence of multi-modal applications (e.g., smart assistants) is anticipated to drive adjustments in app developers' permission management, leading to a diverse market landscape in 2026 [4]. 3D DRAM Technology - Despite slower-than-expected progress in the 3D DRAM supply chain in 2025, optimism remains for 2026, with collaborations between Zhaoyi Innovation and leading companies indicating potential breakthroughs and new application scenarios [5]. Upcoming Trends and Technologies - Several key technology and product trends are expected in the second half of 2025, including the launch of specialized 3D hardware for mobile and automotive applications, which will enhance edge computing and storage capabilities [6][7]. - The AI terminal devices market is projected to gain traction, with major North American clients like OpenAI planning to introduce smart terminal products, potentially driving hardware sales and a replacement wave [7]. - The domestic wafer foundry industry is also highlighted, with leading companies like SMIC and Huahong expanding capacity, ensuring that the N2 process will no longer be a bottleneck for computing power development by 2026 [7]. Power Supply and Infrastructure - The power density in data centers is rapidly increasing, with HVDC (High Voltage Direct Current) expected to become a core focus in 2026, facilitating electrification upgrades and creating new growth opportunities [8][9]. - Upgrades in server power supply technology are anticipated to enhance the value of embedded modules and advanced cooling technologies, with companies like Oulutong and Weiergao positioned to benefit [9]. New Infrastructure and Advanced Packaging - The new infrastructure sector is expected to see significant growth in 2026, particularly in the PCB segment, with new products like CO2 laser drilling and advanced packaging set to achieve full-scale production [10][11]. - Advanced packaging products are expected to gradually achieve mass production among leading packaging and testing manufacturers, indicating a shift from demo machines to essential products in the next two years [11]. Additional Important Insights - The conference call emphasizes the importance of monitoring developments in the electronic industry, particularly in cloud computing, edge computing, and new infrastructure, as these areas are poised for significant growth and investment opportunities in the near future [2][3][4][5][6][7][8][9][10][11].