Group 1: Product Innovation - The company's new product, mSSD, utilizes wafer-level system-in-package (SiP) technology, integrating multiple components into a single package, which significantly reduces manufacturing costs and enhances performance [3] - mSSD is positioned as an upgraded form of traditional SMT SSDs, offering compactness and low power consumption while maintaining performance levels comparable to traditional SSDs, indicating a broad market potential [3] Group 2: Strategic Partnerships - The company is among a few globally capable of developing UFS4.1 products at the chip level, with its UFS4.1 products outperforming market competitors in terms of process, read/write speed, and stability [3] - The company has established deep cooperative relationships with major wafer suppliers, supported by long-term supply agreements, ensuring a robust supply chain even in tight market conditions [3] Group 3: Market Trends - The demand for storage is expected to surge due to the structural changes in AI inference systems and the rapid expansion of AI infrastructure, coupled with HDD supply shortages [4] - The capital expenditure recovery of storage manufacturers will have limited short-term impact on output growth due to the lag in capacity construction [4] Group 4: Disclosure Compliance - The investor relations activity did not involve any undisclosed significant information [4]
江波龙(301308) - 2026年2月3日-6日投资者关系活动记录表