未知机构:东吴电子陈海进翱捷科技MWC全芯阵容首发AI算力与全制式连接共振事件-20260304
ASRASR(SH:688220)2026-03-04 02:30

Summary of Conference Call Records Company: 翱捷科技 (Aojie Technology) Key Points Industry Overview - The conference took place during the MWC 2026 in Barcelona, showcasing Aojie Technology's "full chip lineup" which covers various communication standards including 5G, RedCap, 4G, and AISoC [1][2] Product Launches - Multiple new products were launched, including: - Smart SoCs: ASR8861 (4G) and ASR7801 (octa-core 4G), both integrating 20 TOPS NPU computing power, focusing on edge AI and high energy efficiency while providing stable cellular connectivity and significantly enhancing edge intelligent processing capabilities [1][2] - Wearable Technology: Introduction of a high-performance RTOS single-chip ASR3660, balancing performance and battery life; also launched the Cat.1bis wearable platform ASR8602 and the 5G RedCap platform ASR1905, emphasizing lightweight connectivity for MBB, MiFi, and IoT [2] - Mobile Broadband: New generation Cat.4 & Wi-Fi 6 integrated RF baseband chip ASR1805 was introduced [2] Market Position - The smartphone featuring ASR8861 made its debut, with the 4G octa-core SoC already in mass production and continuing to ramp up output, covering smartphones, tablets, vehicle systems, and AI hardware [2] - Nearly 20 wearable terminal products were showcased from various brands (Philips, Lenovo, 360, Xiaoxun), covering both RTOS and Android platforms, with new RedCap wearable products making their first appearance [2] - In the IoT device sector, the Cat.1bis platform has maintained the number one market share for two consecutive years (according to TSR data), with cumulative shipments exceeding 600 million units, solidifying its market base [2] ASIC Business Development - The company is advancing its ASIC business with numerous ongoing custom projects that are complex and of significant monetary value, with expected substantial revenue growth upon project delivery [3] - Focus areas for custom ASICs include wearable/eyewear chips, cloud inference AI chips, and RISC-V chips, targeting three core incremental markets [3] - In cloud AI inference ASIC projects, the company has developed cost-effective LPDDR solutions for large-scale applications and technologies including 3D DRAM interfaces to meet ultra-high bandwidth applications, catering to differentiated needs of leading clients [3]

未知机构:东吴电子陈海进翱捷科技MWC全芯阵容首发AI算力与全制式连接共振事件-20260304 - Reportify