全球半导体_高位建仓，更高位卖出；先进封装成核心，助力 AI 性能指数级提升-Global Semiconductor_ Stack ‘Em High, Sell ‘Em Higher; Advanced packaging takes center stage to deliver exponential AI performance gains

Stacking in packaging such as CoWoS, SoIC, and HBM is enabling faster chip performance by increasing the bandwidth of chip interconnections and is a key enabler of AI chips. It is also being extended to frontend processes to drive upcoming node migrations. Such technologies could create big opportunities for packaging equipment and material companies. This Blackbook discusses technologies, competition, and major beneficiaries for this multi-year trend. See Disclosure Appendix of this report for important di ...