Group 1: Order and Revenue Insights - The company has seen a significant increase in new orders compared to 2023, with expectations for Q2 2024 to be similar to Q1 [1] - The growth in new orders is attributed to a comprehensive product layout and the ability to sell multiple product series to customers with bulk equipment purchasing needs [1] - The company holds a strong market share in advanced packaging, particularly in the 3D packaging and HBM sectors, with a majority of the domestic advanced packaging capacity [2] Group 2: Revenue Composition - Revenue from front-end processes accounts for approximately 80%, while advanced packaging contributes around 15% [2] - The company's diverse customer base includes clients from logic, memory, power, MEMS chips, compound semiconductors, advanced packaging, and wafer processing equipment [2] Group 3: R&D Investment Trends - The company has consistently increased its R&D investment, focusing on upgrading existing equipment and developing key products such as defect detection and measurement devices [2] - R&D expenses have shown a growth trend, although the R&D expense ratio has fluctuated based on annual circumstances [2]
中科飞测(688361) - 2024年5月16日-17日深圳中科飞测科技股份有限公司投资者关系活动记录表