国芯科技(688262) - 2024年5月16日至5月17日投资者关系活动记录表

Group 1: Quantum Technology Development - The company is actively developing post-quantum cryptography (PQC) chip products, focusing on cost-effective PQC algorithm IP and anti-side-channel attack technologies, with completion expected in 2024 [2] - A new generation quantum random number generator chip, QRNG-10, has been successfully tested, achieving a record size of 4x4 mm, making it the first domestic chip to break the millimeter-level size barrier [4] - A strategic cooperation agreement was signed in Q1 2024 with Hefei Silicon Zhen to establish a joint laboratory for quantum security chips, aiming to develop competitive new technologies and products [4] Group 2: Automotive Electronics Progress - The high-end automotive electronic chip MCU-CCFC3012PT has completed design and is currently in wafer fabrication, expected to finish by the second half of 2024 [5] - This chip is designed for intelligent driving and next-generation domain control systems, featuring a self-developed C3007 CPU core with a multi-core PowerPC architecture, achieving over 2700 DMIPS [5] - The CCFC3012PT chip is comparable in performance to Infineon's TC397 chip, which is widely used in China, indicating significant market application potential [5]