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国芯科技(688262) - 2024年3月6日至3月7日投资者关系活动记录表

Group 1: Market Overview - The automotive electronic MCU market is experiencing accelerated destocking, with demand gradually recovering [4] - Domestic substitution remains a trend in China's automotive electronic chip market, driven by the electrification, intelligence, and connectivity of vehicles [4] - The penetration rate of domestic new energy vehicles is increasing, and exports of domestic brand vehicles are expanding, contributing to the rising demand for automotive electronic chips [4] Group 2: Product Development - In 2023, the company invested significantly in R&D for automotive electronic chips, launching mid-to-high-end automotive electronic MCUs [4] - New products include CCFC3007PT, CCFC3008PT, and CIP4100B, among others, with more high-end MCUs and SoCs expected to be released [5] - The CCFC3009PT chip is designed for automotive assisted driving and intelligent chassis applications, featuring a high-performance RSIC-V architecture [11] Group 3: Key Partnerships and Collaborations - The company collaborates closely with major automotive brands such as BYD, Chery, SAIC, and others, as well as Tier 1 module manufacturers and operating system software vendors [6] - Ongoing partnerships with engine manufacturers like Weichai Power enhance innovation and business synergy [6] Group 4: Future Outlook - The company is focusing on high-performance, high-integration, and high-reliability domain control chips to meet future automotive ECU trends [7] - The CCFC2016BC chip is a mid-range domain controller based on a proprietary PowerPC architecture, already applied in various automotive electronic fields [7] - The CCFC3012PT chip, designed for high-performance applications, is expected to achieve a computing power of over 6000 DMIPS, doubling that of the CCFC3012PT chip [11]