Group 1: Automotive Electronics Development - The company views the evolution of automotive electronic architecture as moving towards centralized domain control and cross-domain control, with a focus on high-performance, high-integration heterogeneous SoC/MCU chips as core processors [2] - Future domain controllers and central processing units will develop towards high performance, high heterogeneity, high integration, high security, and high reliability [2] - The company has laid out mid-range and high-end domain controller chips, including CCFC2016BC, CCFC3007PT, and CCFC3009PT series, which are suitable for various automotive applications [3] Group 2: Chip Development and Features - The CCFC3008PT and CCFC3007PT high-end domain control chips have successfully passed internal testing and are in the process of customer sampling and module development [3] - The CCFC3012PT chip, currently in the design phase, targets advanced driver assistance systems and utilizes a multi-core PowerPC architecture [4] - The company has launched a high-performance DSP chip CCD5001 based on HIFI5 architecture, designed for automotive platforms requiring low latency and high floating-point performance [4] Group 3: Sensor and Interface Solutions - The company is developing an acceleration sensor chip CMA2100B, supporting various detection ranges and PSI5 interface for airbag ECU modules [5] - The PSI5 interface is widely used for connecting automotive sensors to ECUs, applicable in safety airbags, chassis control, and powertrain systems [4] Group 4: RAID Chip Development - The RAID control chip CCRD3316 is comparable to LSI's 9361 series, aiming to achieve domestic substitution for RAID control chips historically dominated by foreign companies [6] - The company's RAID chips and board solutions are currently being developed and tested with over 10 key domestic clients, receiving positive feedback [6]
国芯科技(688262) - 2023年11月28日-30日投资者关系活动记录表