颀中科技(688352) - 合肥颀中科技股份有限公司投资者关系活动记录表(2023年12月13日)

Group 1: Company Overview and Future Plans - Hefei Qizhong Technology Co., Ltd. plans to focus on display business, with an initial capacity of approximately 10,000 wafers per month for 12-inch wafer packaging testing and around 300,000 EA per month for COF [1] - The company maintains a cautiously optimistic outlook for Q4 2023, as the downstream consumer market is gradually recovering, particularly for small and medium-sized products [1] Group 2: Product Application and Market Share - As of September 2023, the display business applications are primarily in high-definition TVs and smart phones, each accounting for over 40%, while laptops are close to 10%; in non-display applications, power management exceeds 50% and RF front-end exceeds 40% [2] Group 3: Technology and Equipment - The company has adopted domestic alternatives for some equipment and collaborates with domestic quality manufacturers such as Shanghai Microelectronics and Huafeng Measurement and Control [2] - The company can achieve a minimum spacing of 6μm between gold bumps, with the ability to "grow" over 4,000 gold bumps on a single small chip, maintaining a height tolerance within 0.8μm, placing multiple indicators at an industry-leading level [2] - The company has achieved mass production processes for multi-layer stacking technology, currently at 4P4M, applicable to power management chips, RF front-end chips, and advanced packaging for new semiconductor materials like gallium arsenide and gallium nitride [2]