Group 1: Company Strategy and Core Competitiveness - The company is restructuring its organization into independent business units based on product lines or project centers to enhance management and assessment efficiency [1] - Continuous digital transformation efforts are being made to achieve intelligent manufacturing, improving production efficiency and quality while reducing costs [2] Group 2: Future Development Plans - The company targets downstream industries including consumer electronics, PCB, new energy, and semiconductors, focusing on leading technology in basic components and deepening application in industry equipment [2] - There is a commitment to increase R&D investment in basic components and industry-specific equipment to strengthen market leadership and achieve sustainable high-quality growth [2] Group 3: Semiconductor Product Overview - The main products in the semiconductor business include laser dicing, laser internal modification cutting equipment, and various testing and packaging devices for semiconductor production [2] Group 4: Mixed Reality (MR) Equipment - The company is actively developing MR-related processing equipment in collaboration with key industry clients, achieving batch sales of these products [2] Group 5: General Industrial Laser Processing Market - The demand for general industrial laser processing equipment, particularly high-power laser processing equipment, has seen a recovery this year [2] - The company is adjusting its market strategy to expand coverage in the mid-to-low-end market, steadily increasing overall market share [2] Group 6: New Energy Sector Business Layout - The company provides specialized equipment for the new energy sector, including lithium battery and photovoltaic industry equipment, and has established good partnerships with leading domestic and international new energy vehicle manufacturers [3] Group 7: Convertible Bond Situation - As of October 24, 2023, the company announced it would not propose a downward adjustment to the conversion price of its convertible bonds until the maturity date on February 6, 2024 [3]
大族激光(002008) - 2023年12月29日投资者关系活动记录表