Group 1: Product Composition and Market Position - The main products of the company include lead frames (57.22%), bonding wires (24.79%), electrode wires (15.58%), and high-precision molds (1.45%) [2][3] - The company has advantages in scale and technology compared to domestic manufacturers, with a complete product line including power frames, IC integrated circuit frames, and etched lead frames [2] Group 2: Profitability and Market Trends - The overall gross margin for lead frame products is around 19%, with etched lead frames having a higher margin than stamped lead frames [3] - The gross margin for bonding wires ranges from over 5% in good years to around 3% in poor years, primarily affected by raw material price increases and market competition [3] Group 3: Future Development Plans - The company plans to focus on its core business, enhance its leading position, and develop products that meet market demand, particularly in the expanding markets of new energy vehicles, wind power, and photovoltaics [3]
康强电子(002119) - 康强电子调研活动信息