金信诺(300252) - 2023年6月26日投资者关系活动记录表

Group 1: Company Overview and Market Position - Shenzhen Jinxinno High-Tech Co., Ltd. focuses on high-speed cable and connector products, primarily serving data centers and supercomputing markets [1] - The company has established a strong presence in the high-speed connection market, with 90% of its high-speed business applied to internal server connections [2] - Jinxinno's products are recognized by top-tier clients, including Ericsson and H3C, and it holds a leading position in several niche markets [3] Group 2: Product Development and Innovation - The company has successfully developed 800G series cables and components, although these products have not yet been sold domestically due to current demand being primarily from overseas clients [2] - Jinxinno has participated in various national research projects related to 5G AI technology, although it has not yet ventured into AI chip development [2] - The company has a robust patent portfolio, with 95 invention patents and participation in the formulation of 22 IEC standards and 8 national standards [3] Group 3: Financial Performance and Future Outlook - In Q1 2023, the company reported a revenue of 649 million, representing a year-on-year growth of 11.45% [4] - The company aims to direct future investments towards special military and high-speed component businesses, with a focus on maintaining stable operations in its existing communication business [5] - Jinxinno's cash flow from operating activities was negative 132 million in 2022, primarily due to increased cash payments to suppliers [7] Group 4: Strategic Initiatives and Challenges - The company is actively expanding its overseas market presence, with over 30% of its sales coming from international clients in 2022 [10] - Jinxinno has faced challenges in its PCB business, which has impacted overall performance, but it is implementing measures to improve product yield and management efficiency [10] - The company is optimistic about its future growth, particularly in the fields of aerospace, satellite communications, and 5G+ smart manufacturing [11]