润欣科技(300493) - 2023年2月8日投资者关系活动记录表

Group 1: Company Overview and Collaboration - Shanghai Runxin Technology Co., Ltd. is collaborating with Qiyimoer to develop customized Chiplet chip design services, leveraging their respective customer and technical advantages [1][2]. - The partnership aims to enhance the Chiplet industry ecosystem, focusing on applications in smart cities, automotive electronics, and wearable technology [2][4]. Group 2: Technical Insights and Innovations - The current trend in semiconductor technology is shifting towards heterogeneous integration, with Chiplet architecture allowing for modular designs that can achieve high performance while reducing costs [3][4]. - Chiplet designs can support various applications, including AI, smart cities, and autonomous driving, by providing flexible and scalable solutions [3][5]. Group 3: Market Trends and Projections - According to data from Chip Origin and Yole, a significant portion of chip deliveries will adopt Chiplet technology by 2035, with a projected double-digit CAGR starting this year [4][5]. - The demand for high-performance chips in sectors like AI and automotive is driving the need for advanced Chiplet solutions, with specific performance requirements ranging from 100 TOPS to 2000 TOPS depending on the application [2][3]. Group 4: Challenges and Solutions - Heat dissipation remains a challenge in heterogeneous chip stacking, but Chiplet architecture can improve data scheduling and processing efficiency, thereby reducing unnecessary heat generation [3][4]. - The industry faces challenges in adapting software solutions to various application scenarios, highlighting the importance of tailored Chiplet designs [4][6]. Group 5: Future Directions - The collaboration between Qiyimoer and Runxin is expected to lead to the production of low-end products by the end of the year, focusing on applications in AIOT and MEMS sensors [5][6]. - The Chiplet market is anticipated to evolve with increasing automation and efficiency in manufacturing processes, allowing for cost-effective production despite the diversity of applications [6].