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晶方科技(603005) - 2022 Q4 - 年度财报
603005WLCSP(603005)2023-04-24 16:00

Financial Performance - Total revenue for 2022 was CNY 1,106,070,998.70, a decrease of 21.6% from CNY 1,411,173,857.40 in 2021[12] - The net profit for the current period is 232,774,115.21 RMB, a decrease from 578,721,724.29 RMB in the previous period, representing a decline of approximately 59.8%[13] - The company reported a total comprehensive income of 214,322,264.42 RMB, compared to 550,367,121.83 RMB in the previous year, a decline of about 61.0%[16] - The net profit attributable to shareholders was approximately ¥227.85 million, down 60.45% from ¥576.05 million in the previous year[73] - The basic earnings per share decreased to ¥0.35, a decline of 60.23% from ¥0.88 in 2021[75] - The company's operating revenue for the period was ¥1,106,070,998.70, a decrease of 21.62% compared to ¥1,411,173,857.40 in the previous year[127] - Operating profit for 2022 was 258.003 million RMB, down 59.63% compared to the previous year[153] Assets and Liabilities - Current assets totaled approximately ¥2.51 billion, a decrease of 1.95% from ¥2.56 billion in the previous year[7] - Non-current assets increased to approximately ¥2.07 billion, a rise of 9.23% from ¥1.90 billion[8] - Total assets reached approximately ¥4.59 billion, an increase of 2.81% from ¥4.46 billion[8] - Total liabilities amounted to approximately ¥566.77 million, an increase of 9.66% from ¥516.79 million[9] - Shareholders' equity totaled approximately ¥4.02 billion, up 1.91% from ¥3.95 billion[9] - Total assets reached CNY 4,484,199,713.25, up from CNY 4,315,762,387.49, reflecting overall growth in the company's financial position[12] - Total liabilities increased to CNY 472,542,695.19 from CNY 422,628,143.87, indicating a rise in financial obligations[12] Cash Flow - The company reported a net cash flow from operating activities of approximately ¥391.75 million, down 36.10% from ¥613.10 million in 2021[73] - The net cash flow from operating activities decreased by 36.10% to ¥391,750,297.78 in 2022 from ¥613,101,286.33 in 2021[3] - The net cash flow from investing activities improved by 28.01%, reducing the outflow to ¥630,585,198.91 from ¥875,936,754.20[3] - The net cash flow from financing activities decreased significantly by 69.22% to ¥3,468,237.74 from ¥11,266,262.04, primarily due to cash dividends paid in 2021[3] Research and Development - Research and development expenses increased to 193,056,982.44 RMB, up from 179,966,040.55 RMB, reflecting a growth of about 7.5%[13] - The company's total R&D expenditure was ¥193 million, accounting for 17.45% of total revenue, reflecting ongoing investment in technology and process development[166] - The proportion of R&D personnel increased to 27.44%, with a total of 267 R&D staff members[8] - The company is actively involved in a national key R&D project for advanced packaging testing platforms for MEMS sensors, aiming to overcome key technical challenges[87] Market and Industry Trends - Global semiconductor sales reached 573.5billionin2022,a3.2573.5 billion in 2022, a 3.2% increase from 555.9 billion in 2021, but the market growth slowed significantly in the second half of the year[82] - The automotive chip market saw significant growth, reaching 34.1billioninsales,a29.234.1 billion in sales, a 29.2% increase[89] - The global CIS market size was reported at 18.495 billion in 2022, marking a slight decline from the previous year, the first negative growth in seven years[111] - The global image sensor shipment volume grew from 4.14 billion units in 2016 to 7.72 billion units in 2020, with a projected CAGR of 8.5% from 2021 to 2025[90] Strategic Initiatives - The company is focusing on the development of advanced integrated circuit packaging technology and expanding its micro-optical components business[84] - The company is actively pursuing mergers and acquisitions of international advanced technologies to extend its industrial chain[84] - The company aims to enhance its competitive advantage through continuous technological innovation[84] - The company is investing in Israeli VisIC to expand its layout in high-power GaN technology for automotive applications, leveraging its advanced packaging capabilities[86] - The company aims to establish a research institute for automotive semiconductor technology in Suzhou, focusing on new processes, materials, and equipment to build an industrial ecosystem[86] Operational Challenges - The decline in electronic components revenue was primarily due to a downturn in the consumer electronics market, particularly in mobile phones, leading to reduced packaging orders and shipment volumes[131] - The company reported a significant decrease in sales from the domestic market, with revenue down 46.07% year-over-year, while foreign sales increased by 1.01%[158] - The production volume of wafer-level packaging products decreased by 39.12%, while sales volume dropped by 40.59%[160] - The company had a reliance on a few major customers, with the top five customers accounting for 72.58% of total sales, indicating potential risks in customer concentration[163]