Thinkon Semi(688233)2024-05-10 11:01Operational Projects - The company adjusted the expected operational status date for the 8-inch semiconductor-grade silicon single crystal polishing wafer production project to February 2024[2]. Financial Performance - The company reported an accounts receivable balance of 60.32 million yuan and a bad debt provision of 8.14 million yuan at the end of the reporting period[7]. - The total fair value of financial derivatives at the end of the period is RMB 40,636,991.13, with a fair value change gain of RMB 121,681.44[11]. - The total fair value of financial assets measured at fair value is RMB 45,872,531.75, with a total purchase amount of RMB 136,817,225.00 and total sale/redemption amount of RMB 150,820,214.00[11]. - The company reported a cumulative fair value change of RMB 25,409.80 for other financial assets[11]. Research and Development - The company aims to enhance product competitiveness by increasing R&D investment and optimizing product structure[6]. - The company has established a dedicated project development team to ensure the smooth progress of R&D projects[3]. - The company is committed to continuous innovation and enhancing its industry competitiveness through technology and talent development[5]. Market Strategy - The company is focusing on expanding its domestic market share by strengthening its sales and after-sales service network[6]. - The company has successfully entered the international advanced semiconductor materials supply chain and aims to maintain long-term stable relationships with existing customers[5]. - The company is actively exploring new customer relationships, particularly with emerging equipment manufacturers and end integrated circuit clients in the domestic semiconductor industry[6]. Supplier and Procurement Management - The company emphasizes the importance of supplier management to reduce procurement costs while ensuring the quality of raw materials[6]. Accounts Receivable Management - The company is facing a downturn in the conductor industry, leading to decreased sales from downstream customers and increased collection pressure, resulting in temporary overdue accounts[8]. - To address overdue accounts, the company has implemented measures including enhancing the management of accounts receivable and increasing the frequency of tracking overdue accounts[8]. - The company plans to further improve internal control management of accounts receivable, focusing on credit policies, collection tracking, and incentive mechanisms to reduce overdue risks[8]. Information Disclosure - The company acknowledges the need to enhance the quality of information disclosure and will strengthen the review process for disclosure documents[19]. - The company will disclose the corrected annual report on the Shanghai Stock Exchange website on the same day as this announcement[19]. - The company expresses apologies for any inconvenience caused to investors due to the corrections made[19]. - The board of directors of Jinzhou Shengo Semiconductor Co., Ltd. made this announcement on May 11, 2024[21].