WLCSP(SH:603005)2021-08-27 16:00Financial Performance - The company's operating revenue for the first half of 2021 reached ¥694,439,126.57, representing a 52.63% increase compared to ¥454,989,121.00 in the same period last year[22]. - Net profit attributable to shareholders for the first half of 2021 was ¥267,884,204.23, up 71.66% from ¥156,057,139.24 in the previous year[22]. - The net profit after deducting non-recurring gains and losses was ¥237,446,418.50, reflecting an 83.97% increase from ¥129,069,221.11 year-on-year[22]. - The net cash flow from operating activities increased to ¥325,762,656.44, a 96.37% rise compared to ¥165,894,692.44 in the same period last year[22]. - Basic earnings per share for the first half of 2021 were ¥0.66, a 34.69% increase from ¥0.49 in the same period last year[22]. - Operating profit reached 30,866.41 million CNY, up 76% compared to the previous year[42]. - Net profit for the period was 26,886.73 million CNY, reflecting a 72% increase year-on-year[42]. - The total comprehensive income for the first half of 2021 was CNY 263,796,113.70, compared to CNY 157,932,976.64 in the same period of 2020, reflecting an increase of about 67%[149]. Market and Industry Insights - The semiconductor market is expected to reach a size of $52.15 billion by 2024, with a CAGR of 4.8% from 2020 to 2024[33]. - The integrated circuit market is projected to account for nearly 80% of the semiconductor industry, reaching $414.95 billion by 2024, with a CAGR of 4.5% from 2020 to 2024[33]. - China's integrated circuit industry is expected to grow from ¥761.64 billion in 2019 to ¥1,580.59 billion by 2024, with a CAGR of 15.7%[33]. - The global semiconductor market has been steadily growing since 2012, with a market size of $408.99 billion in 2019[32]. - The global semiconductor market sales reached $253.1 billion in the first half of 2021, a year-on-year increase of 21.4%[38]. - China's integrated circuit industry sales amounted to 410.29 billion yuan in the first half of 2021, growing by 15.9% year-on-year[38]. Research and Development - Research and development expenses rose by 16.68% to 81,299,941.38 CNY, indicating a focus on innovation[42]. - The company has developed a total of 485 patents, including 256 patents authorized in mainland China, 86 in the United States, and 40 in South Korea[34]. - The company is committed to continuous innovation in technology and processes, optimizing its 8-inch and 12-inch wafer-level TSV packaging processes to increase production capacity[38]. - The company is focused on semiconductor technology and has established a strong presence in the market[193]. Operational Highlights - The increase in net profit attributable to shareholders was primarily due to the increase in packaging shipment volume, leading to higher revenue[22]. - The increase in net cash flow from operating activities was attributed to rapid sales growth and increased cash received from sales of goods and services[25]. - The company operates in the packaging and testing sector of the semiconductor industry, focusing on advanced packaging technologies for various applications[30]. - The company provides packaging and testing services primarily to chip design companies, which are responsible for the design and sales of chips[30]. - The company has established long-term relationships with suppliers to ensure the procurement of raw materials necessary for production[30]. Environmental and Regulatory Compliance - The company’s wastewater treatment facilities include acid-base neutralization and COD online monitoring, with no exceedance of discharge standards reported[75]. - The company’s air pollution control facilities are operational, with no exceedance of discharge standards for pollutants such as acetone and formaldehyde[74]. - The company has achieved ISO 14001 certification for its environmental management system, emphasizing its commitment to environmental protection and sustainable practices[82]. - The company has implemented energy management improvements, saving approximately 110,050 kWh of electricity, which indirectly reduces carbon emissions[85]. - The company has not faced any administrative penalties related to environmental issues during the reporting period[82]. Shareholder and Equity Information - The company distributed cash dividends of 0.235 CNY per share and issued 34,006,476 bonus shares, with a total cash dividend payout of 79,915,219.54 CNY[109]. - The total share capital increased from 321,551,237 to 408,077,716 shares due to a non-public offering and stock incentives, leading to a 16.67% decrease in earnings per share and a 16.32% decrease in net assets per share for the first half of 2021[110]. - The company has a commitment from its major shareholders to not reduce their holdings for three years post-IPO, with specific conditions for future share sales[88]. - The company has a diverse shareholder structure, with Engineering and IP Advanced Technologies Ltd. holding 35.27% of the registered capital[194]. Financial Position and Assets - The total assets at the end of the reporting period were ¥4,274,178,278.05, which is a 14.48% increase from ¥3,733,560,121.10 at the end of the previous year[22]. - The total liabilities reached ¥700,910,834.34, up from ¥369,096,100.61, representing a significant increase of about 89.9%[136]. - The company's equity attributable to shareholders was RMB 3,547,311,978.03, compared to RMB 3,364,464,020.49, showing an increase of approximately 5.4%[136]. - The company's cash and cash equivalents were RMB 2,161,849,649.21, slightly down from RMB 2,187,727,332.60, reflecting a decrease of approximately 1.2%[131]. - The total comprehensive income for the current period was CNY 267,884,204.23, indicating a strong performance despite the decrease in other comprehensive income[169].