CHIPPACKING(SH:688216)2022-05-23 16:00Financial Performance - The company's operating revenue for 2021 was approximately CNY 809.36 million, representing a 47.69% increase compared to CNY 548.00 million in 2020[19]. - The net profit attributable to shareholders for 2021 was approximately CNY 134.59 million, a 67.46% increase from CNY 80.37 million in 2020[19]. - The cash flow from operating activities for 2021 was approximately CNY 221.36 million, showing a significant increase of 284.76% compared to CNY 57.53 million in 2020[19]. - The company's total assets at the end of 2021 were approximately CNY 1.85 billion, an increase of 77.04% from CNY 1.04 billion at the end of 2020[19]. - The net assets attributable to shareholders at the end of 2021 were approximately CNY 1.00 billion, reflecting an 83.52% increase from CNY 545.72 million at the end of 2020[19]. - The basic earnings per share for 2021 were CNY 1.45, a 43.56% increase from CNY 1.01 in 2020[20]. - The company reported a net profit of CNY 126.39 million after deducting non-recurring gains and losses, which is a 69.45% increase from CNY 74.59 million in 2020[19]. - The total operating revenue increased by 47.69% compared to the previous year, driven by strong terminal demand and increased product sales, along with higher sales prices for some products[22]. - Net profit attributable to shareholders grew by 67.46%, with a net profit excluding non-recurring gains and losses increasing by 69.45%, primarily due to higher revenue and improved gross margin[22]. - Net cash flow from operating activities surged by 284.76%, attributed to increased customer payments and a significant rise in accounts payable[22]. Research and Development - The R&D expenditure as a percentage of operating revenue was 6.87% in 2021, up from 6.39% in 2020[21]. - The company achieved a total R&D investment of ¥55,642,780.69, representing a 58.87% increase compared to the previous year's ¥35,024,111.27[59]. - The increase in R&D investment is attributed to a rise in personnel and salary costs due to the company's commitment to enhancing its R&D capabilities[60]. - The company has developed a mixed-signal product for electric meters, addressing challenges in multilayer wiring and 3D packaging[56]. - The company has made significant advancements in packaging technology for high-temperature RFID tags, catering to the IoT industry[56]. - The company has developed a high-power GaN RF amplifier packaging technology for 5G macro base stations, achieving mass production[55]. - A total of 32 new patents were applied for during the reporting period, with 33 patents granted, bringing the cumulative total to 283 applications and 204 grants[57]. Market and Industry Trends - In 2021, China's integrated circuit industry sales reached 1,045.83 billion yuan, a year-on-year growth of 18.2%[33]. - The global semiconductor market grew by 26.2% in 2021, with sales reaching $555.9 billion, while China's semiconductor sales totaled $192.5 billion, up 27.1%[32]. - The packaging and testing sector in China generated sales of 276.3 billion yuan in 2021, reflecting a year-on-year increase of 10.1%[46]. - The integrated circuit packaging and testing industry in China is projected to reach a market value of CNY 330 billion by 2023, with a compound annual growth rate of 9.6% from 2021 to 2023[111]. Corporate Governance - The company has not proposed any stock bonus or capital reserve transfer to increase share capital[4]. - The company does not have any special arrangements for corporate governance[7]. - The board of directors and management guarantee the authenticity and completeness of the annual report[6]. - The company has established a governance structure compliant with relevant laws and regulations, ensuring effective operation of its shareholder meetings and board[117]. - The company’s board of directors includes independent directors who participated fully in board meetings, with no instances of absenteeism reported[141]. Environmental and Social Responsibility - The company has established a complete environmental management system and has obtained ISO 14001:2015 certification[161]. - The company has implemented measures to reduce carbon emissions, including the purchase of low-power energy-saving equipment and limiting air conditioning temperatures to no lower than 27°C[170]. - The company has successfully reduced waste generation by outsourcing metal surface treatment processes to specialized firms[3]. - The company actively engages in community support, contributing 20,000 RMB to poverty alleviation efforts[172]. - The company has helped 74 individuals find employment through targeted recruitment activities in collaboration with local government[175]. Future Outlook - The report includes forward-looking statements regarding future plans and strategies, which do not constitute commitments to investors[5]. - The company aims to expand its market coverage and order scale by developing high-quality customers, particularly in the third-generation semiconductor packaging and testing business[113]. - The company plans to strengthen its talent acquisition and training efforts, building a professional talent pipeline through collaboration with universities and vocational schools[114]. - The company is committed to becoming an "international first-class packaging testing service provider" while redefining new packaging forms to drive innovation in the integrated circuit packaging and testing industry[112].