Core Insights - Ansys is collaborating with Intel Foundry to enhance thermal management technology for the Intel 18A silicon process, focusing on high-performance computing, graphics, and AI products for U.S. national security applications [1][2][3] Group 1: Collaboration and Alliance - Ansys has joined the Intel Foundry Accelerator USMAG Alliance to support secure chip design methodologies for military, aerospace, and government applications [2][4] - The collaboration aims to optimize Ansys' semiconductor simulation tools to meet the requirements of Intel Foundry's process design kits (PDKs) [2][3] Group 2: Technical Enhancements - Ansys is enhancing its Redhawk-SC platform to provide a comprehensive thermal management flow for the Intel 18A process, which includes innovative backside power delivery technology, PowerVia [3][4] - The partnership will also focus on signoff verification of thermal and power integrity, as well as mechanical reliability for Intel's embedded multi-die interconnect bridge (EMIB) technology [3][4] Group 3: Industry Impact - The collaboration addresses complex multiphysics challenges and stringent requirements in thermal, power, mechanical, and reliability aspects for military and aerospace products [4] - Ansys' simulation capabilities are expected to deliver greater value to customers in the semiconductor industry, particularly in the context of national security [4]
Ansys Joins Intel Foundry's United States Military, Aerospace, and Government (USMAG) Alliance