行 业 及 产 业 行 业 研 究 / 行 业 深 相关研究 《国资再入股概伦电子——EDA 行业月报 202602 期》 2026/02/03 《 IPO 活跃，行业进入加速发展阶段—— EDA 行业月报 202601 期》 2026/01/05 证券分析师 黄忠煌 A0230519110001 huangzh@swsresearch.com 研究支持 王开元 A0230125030001 wangky@swsresearch.com 联系人 王开元 A0230125030001 wangky@swsresearch.com 2026 年 03 月 20 日 系统级时代来临，芯和领衔国产多 物理场仿真 看好 ——EDA 行业系列报告 202603 期 本期投资提示： 度 证 请务必仔细阅读正文之后的各项信息披露与声明 券 研 究 报 告 计算机 ⚫ 本期 EDA 报告重点介绍 EDA 行业中多物理场仿真这一细分领域，核心说明这一能力在 EDA 工具中的重要性快速提升，EDA+CAE 的融合为行业趋势。 ⚫ 半导体行业进入系统级时代，多物理场仿真成为 EDA 重要需求。芯片层级：底层驱动是 后摩尔时代，芯片需 ...

Core Viewpoint - TSMC's latest EDA alliance list, announced on February 6, includes 12 member companies, reflecting the industry's structural adjustments and the importance of EDA in semiconductor development [1][3]. Group 1: EDA Alliance Composition - The EDA alliance remains stable, with major players like Synopsys, Cadence, and Siemens EDA maintaining their dominant positions, while Primarius is the only domestic EDA company included [1][3]. - Ansys has exited the alliance due to its acquisition by Synopsys, which enhances Synopsys's influence within TSMC's EDA ecosystem [3]. - The remaining 11 members of the alliance have not changed, indicating a stable ecosystem [3]. Group 2: Domestic EDA Industry - Primarius's continued presence as the sole Chinese EDA firm highlights its technical recognition and the current state of the domestic EDA industry [4]. - Primarius focuses on core EDA areas such as modeling, simulation, and circuit verification, serving mid-to-high-end analog and mixed-signal circuit design, demonstrating strong technical capabilities [4]. - The exit of Empyrean from the alliance, following significant changes, underscores the challenges faced by domestic EDA firms in maintaining their positions in global ecosystems [7][8]. Group 3: Industry Dynamics - The TSMC EDA alliance is part of its Open Innovation Platform (OIP), aimed at collaborating with global EDA vendors for tool adaptation and methodology optimization [7]. - The stability and minor adjustments in the alliance reflect the ongoing dominance of international EDA giants in the advanced EDA field, while domestic firms still face significant technological gaps [10]. - Domestic EDA companies like Primarius are gradually overcoming technical barriers and integrating into the global semiconductor manufacturing ecosystem through focused R&D and collaboration with foundries [10].

Group 1 - The DJS Law Group is investigating claims on behalf of investors of Ansys, Inc. for potential violations of securities laws [1] - The investigation is focused on whether Ansys issued misleading statements or failed to disclose important information to investors [1] - Shareholders who have suffered losses are encouraged to contact DJS Law Group to participate in the investigation [1] Group 2 - DJS Law Group specializes in enhancing investor returns through balanced counseling and aggressive advocacy [2] - The firm focuses on securities class actions, corporate governance litigation, and M&A appraisals, serving large hedge funds and alternative asset managers [2] - The litigation claims of clients are considered valuable assets that require respect, focus, and results [2]

Core Viewpoint - Ansys, Inc. is currently under investigation on behalf of investors, indicating potential legal issues that may affect the company's stock performance and investor rights [1] Group 1 - The investigation is being conducted by DJS Law Group, which is reaching out to investors to discuss their rights regarding the situation [1]

Core Viewpoint - Ansys, Inc. is currently under a fraud investigation, and investors have the opportunity to join the legal proceedings initiated by the Schall Law Firm [1] Group 1 - The investigation pertains to potential fraudulent activities involving Ansys, Inc. [1] - The Schall Law Firm is actively seeking investors who may have been affected by the alleged fraud [1]

The company, which makes software to design and test computer chips, saw revenue rise to $2.25 billion as its acquisition of Ansys boosted sales. ...

Market Overview - The PCB Design Software Market was valued at USD 4.32 Billion in 2025E and is projected to reach USD 12.11 Billion by 2033, growing at a CAGR of 13.77% from 2026 to 2033 [1][13]. U.S. Market Insights - The U.S. PCB Design Software Market size was USD 1.19 Billion in 2025E and is expected to grow to USD 3.26 Billion by 2033, with a CAGR of 13.47% during 2026-2033 [3]. - Key drivers include strong R&D capabilities, rapid integration of cloud-based tools and AI, and the demand for fast, small electronics [3]. Segmentation Analysis By Component - In 2025, the Software segment led the market with a share of 72.80%, while the Service segment is the fastest-growing with a CAGR of 13.60% [4]. By Technology - High-end Software dominated the market in 2025 with a share of 46.50%, and the Mainstream Software segment is the fastest-growing with a CAGR of 14.1% [5]. By Deployment - On-premises solutions led the market in 2025 with a share of 58.70%, while the Cloud segment is expected to grow the fastest with a CAGR of 15.4% [6][7]. By Application - Computer & Consumer Electronics held the largest share of 34.60% in 2025, and Automotive Components is the fastest-growing segment with a CAGR of 15.80% [8]. Regional Insights - North America dominated the PCB Design Software Market in 2025E with over 38.20% revenue share, driven by advanced electronic design automation tools and investments in multilayer PCB technologies [9]. - The Asia Pacific region is expected to have the fastest-growing CAGR of 14.92%, attributed to rapid growth in electronics manufacturing and automation in PCB design processes [10]. Key Companies - Major players in the PCB Design Software market include Cadence Design Systems, Siemens EDA (Mentor Graphics), Altium Limited, Autodesk, Inc., and others [14]. Recent Developments - In May 2025, Cadence launched the Millennium M2000 Nvidia-GPU supercomputer, enhancing GPU-accelerated simulation performance for PCB and chip-level verification workflows [18]. - Siemens introduced Xpedition Standard, emphasizing AI features and cloud connectivity for faster design cycles [18].

Core Viewpoint - The article discusses the challenges and considerations in managing thermal and mechanical stress in multi-chip components, particularly in the context of advanced packaging and 3D integrated circuits (3D-IC) [2][4][14]. Group 1: Thermal and Mechanical Stress Management - Understanding the usage and packaging of devices is crucial for managing thermal and mechanical stress, especially as transistor utilization in AI applications increases power consumption from approximately 500 watts to potentially 1000 watts per square centimeter [2]. - The interaction between thermal and mechanical stress is significant, as mechanical stress can affect thermal stress and vice versa, particularly during the assembly process of multi-chip systems [4][5]. - Advanced packaging technologies complicate heat dissipation, necessitating careful modeling and simulation to ensure reliability and performance [5][6][7]. Group 2: Design and Simulation Challenges - The complexity of heat dissipation paths in 3D-ICs requires more sophisticated modeling than previous generations of hardware, as traditional methods are no longer sufficient [6][7]. - Different layers in multi-chip stacks can introduce new thermal sources, necessitating simultaneous electrical and thermal simulations to understand their interactions [7][8]. - The need for accurate data from foundries is emphasized, as it is essential for creating reliable models that account for stress and thermal effects during the design process [5][13]. Group 3: Impact on Device Performance - Variations in temperature and stress across different chips can lead to performance discrepancies, highlighting the importance of modeling these factors during the design phase [12][10]. - The article notes that all forms of stress can impact device performance, necessitating a comprehensive approach to modeling and simulation [12][10]. - The introduction of new cooling methods, such as microfluidic cooling, presents additional factors to consider in thermal management strategies [13]. Group 4: Future Directions and Industry Trends - The semiconductor industry is increasingly focusing on the implications of stress in manufacturing processes, with foundries recognizing the importance of stress and warpage analysis [5][14]. - There is a growing trend towards integrating thermal analysis into the early stages of chip design to prevent issues related to heat management [8][14]. - The role of artificial intelligence in developing tools for stress-aware testing and design optimization is becoming more prominent, indicating a shift towards more advanced methodologies in the industry [13].

Core Insights - The 3D IC market is projected to grow from USD 16.85 billion in 2025 to USD 50.19 billion by 2033, with a CAGR of 14.64% from 2026 to 2033 [1][7] - The market is driven by the increasing demand for high-performance and energy-efficient chips across various applications, including AI, 5G, HPC, and smartphones [1] Market Size and Growth - The U.S. 3D IC market is estimated at USD 4.75 billion in 2025 and is expected to grow at a CAGR of 14.33%, reaching USD 13.86 billion by 2033 [2] Key Segmentation By 3D Technology - Wafer-level packaging is expected to hold the largest market share at 68.23% in 2025, driven by trends in miniaturization and cost savings [8] - System integration is projected to be the fastest-growing technology with a CAGR of 14.79% due to rising demand for heterogeneous integration [8] By Product - Sensors are anticipated to lead the market with a 33.14% share in 2025, crucial for real-time data processing in various applications [9] - The memories segment is expected to grow the fastest, with a CAGR of 15.33%, driven by the needs of cloud computing and AI [9] By Application - The ICT/Telecommunication segment is expected to dominate with a 34.65% share in 2025, fueled by high-speed networking and 5G adoption [10] - Consumer electronics are projected to witness the fastest growth at a CAGR of 15.92%, driven by advanced smartphones and gaming systems [10] By Component - The Through Silicon Vias (TSVs) segment is projected to hold the largest share at 46.32% in 2025, known for better interconnections and lower power consumption [11] - The Through Glass Vias (TGVs) segment is expected to grow at the fastest CAGR of 15.16% due to superior electrical properties [12] Regional Insights - North America is expected to dominate the 3D IC market in 2025, accounting for 39.12% of revenue, driven by R&D in AI and cloud computing [13] - The Asia Pacific region is projected to experience the fastest growth from 2026 to 2033, with a CAGR of 15.45%, supported by a strong semiconductor manufacturing base [13] Leading Market Players - Key players in the 3D IC market include IBM, ASE Technology Holding Co. Ltd., STMicroelectronics, SAMSUNG, Taiwan Semiconductor Co. Ltd., TOSHIBA CORPORATION, Micron Technology Inc., MonolithIC 3D Inc., Intel Corporation, TEZZARON, Amkor Technology, Jiangsu Changdian Technology Co. Ltd., and United Microelectronics Corporation [5]

Core Viewpoint - The article discusses the divestiture of Synopsys' Optical Solutions Group and PowerArtist business to Keysight Technologies as a necessary step for regulatory approval of Synopsys' acquisition of Ansys, which was completed on July 17, 2025. The divestiture is expected to be finalized around October 17, 2025, and is not anticipated to have a significant financial impact on Synopsys [1][4]. Group 1: Synopsys' Divestiture - Synopsys has received all necessary approvals to proceed with the divestiture of its Optical Solutions Group (OSG) and PowerArtist business to Keysight Technologies, which is seen as essential for the regulatory approval of the Ansys acquisition [1][4]. - The OSG provides design tools and services for high-precision optical product simulation and visualization, including tools like CODE V, LightTools, LucidShape, RSoft, and the recently launched ImSym [2][3]. - The divestiture is expected to allow for a seamless transition for employees, customers, and partners, with OSG continuing to operate as part of Synopsys until the transaction is completed [3][4]. Group 2: Keysight Technologies' Acquisition - Keysight Technologies aims to expand its software simulation product portfolio through the acquisition of Synopsys' Optical Solutions Group, enabling support for high-performance systems beyond electronics, including optics and photonics [3][5]. - The acquisition of PowerArtist, a comprehensive RTL power design platform, is intended to enhance Keysight's position in high-performance system design and simulation software [4][5]. - Both Synopsys and Ansys believe that the sale of PowerArtist is necessary for regulatory approval, and the transition will be managed to ensure continuity of service for customers [4][5].