Core Viewpoint - Ansys, Inc. is currently under investigation on behalf of investors, indicating potential legal issues that may affect the company's stock performance and investor rights [1] Group 1 - The investigation is being conducted by DJS Law Group, which is reaching out to investors to discuss their rights regarding the situation [1]

LOS ANGELES--(BUSINESS WIRE)---- $ANSS--ANSS Investors Have Opportunity to Join Ansys, Inc. Fraud Investigation with the Schall Law Firm. ...

The company, which makes software to design and test computer chips, saw revenue rise to $2.25 billion as its acquisition of Ansys boosted sales. ...

Market Overview - The PCB Design Software Market was valued at USD 4.32 Billion in 2025E and is projected to reach USD 12.11 Billion by 2033, growing at a CAGR of 13.77% from 2026 to 2033 [1][13]. U.S. Market Insights - The U.S. PCB Design Software Market size was USD 1.19 Billion in 2025E and is expected to grow to USD 3.26 Billion by 2033, with a CAGR of 13.47% during 2026-2033 [3]. - Key drivers include strong R&D capabilities, rapid integration of cloud-based tools and AI, and the demand for fast, small electronics [3]. Segmentation Analysis By Component - In 2025, the Software segment led the market with a share of 72.80%, while the Service segment is the fastest-growing with a CAGR of 13.60% [4]. By Technology - High-end Software dominated the market in 2025 with a share of 46.50%, and the Mainstream Software segment is the fastest-growing with a CAGR of 14.1% [5]. By Deployment - On-premises solutions led the market in 2025 with a share of 58.70%, while the Cloud segment is expected to grow the fastest with a CAGR of 15.4% [6][7]. By Application - Computer & Consumer Electronics held the largest share of 34.60% in 2025, and Automotive Components is the fastest-growing segment with a CAGR of 15.80% [8]. Regional Insights - North America dominated the PCB Design Software Market in 2025E with over 38.20% revenue share, driven by advanced electronic design automation tools and investments in multilayer PCB technologies [9]. - The Asia Pacific region is expected to have the fastest-growing CAGR of 14.92%, attributed to rapid growth in electronics manufacturing and automation in PCB design processes [10]. Key Companies - Major players in the PCB Design Software market include Cadence Design Systems, Siemens EDA (Mentor Graphics), Altium Limited, Autodesk, Inc., and others [14]. Recent Developments - In May 2025, Cadence launched the Millennium M2000 Nvidia-GPU supercomputer, enhancing GPU-accelerated simulation performance for PCB and chip-level verification workflows [18]. - Siemens introduced Xpedition Standard, emphasizing AI features and cloud connectivity for faster design cycles [18].

Core Viewpoint - The article discusses the challenges and considerations in managing thermal and mechanical stress in multi-chip components, particularly in the context of advanced packaging and 3D integrated circuits (3D-IC) [2][4][14]. Group 1: Thermal and Mechanical Stress Management - Understanding the usage and packaging of devices is crucial for managing thermal and mechanical stress, especially as transistor utilization in AI applications increases power consumption from approximately 500 watts to potentially 1000 watts per square centimeter [2]. - The interaction between thermal and mechanical stress is significant, as mechanical stress can affect thermal stress and vice versa, particularly during the assembly process of multi-chip systems [4][5]. - Advanced packaging technologies complicate heat dissipation, necessitating careful modeling and simulation to ensure reliability and performance [5][6][7]. Group 2: Design and Simulation Challenges - The complexity of heat dissipation paths in 3D-ICs requires more sophisticated modeling than previous generations of hardware, as traditional methods are no longer sufficient [6][7]. - Different layers in multi-chip stacks can introduce new thermal sources, necessitating simultaneous electrical and thermal simulations to understand their interactions [7][8]. - The need for accurate data from foundries is emphasized, as it is essential for creating reliable models that account for stress and thermal effects during the design process [5][13]. Group 3: Impact on Device Performance - Variations in temperature and stress across different chips can lead to performance discrepancies, highlighting the importance of modeling these factors during the design phase [12][10]. - The article notes that all forms of stress can impact device performance, necessitating a comprehensive approach to modeling and simulation [12][10]. - The introduction of new cooling methods, such as microfluidic cooling, presents additional factors to consider in thermal management strategies [13]. Group 4: Future Directions and Industry Trends - The semiconductor industry is increasingly focusing on the implications of stress in manufacturing processes, with foundries recognizing the importance of stress and warpage analysis [5][14]. - There is a growing trend towards integrating thermal analysis into the early stages of chip design to prevent issues related to heat management [8][14]. - The role of artificial intelligence in developing tools for stress-aware testing and design optimization is becoming more prominent, indicating a shift towards more advanced methodologies in the industry [13].

Core Insights - The 3D IC market is projected to grow from USD 16.85 billion in 2025 to USD 50.19 billion by 2033, with a CAGR of 14.64% from 2026 to 2033 [1][7] - The market is driven by the increasing demand for high-performance and energy-efficient chips across various applications, including AI, 5G, HPC, and smartphones [1] Market Size and Growth - The U.S. 3D IC market is estimated at USD 4.75 billion in 2025 and is expected to grow at a CAGR of 14.33%, reaching USD 13.86 billion by 2033 [2] Key Segmentation By 3D Technology - Wafer-level packaging is expected to hold the largest market share at 68.23% in 2025, driven by trends in miniaturization and cost savings [8] - System integration is projected to be the fastest-growing technology with a CAGR of 14.79% due to rising demand for heterogeneous integration [8] By Product - Sensors are anticipated to lead the market with a 33.14% share in 2025, crucial for real-time data processing in various applications [9] - The memories segment is expected to grow the fastest, with a CAGR of 15.33%, driven by the needs of cloud computing and AI [9] By Application - The ICT/Telecommunication segment is expected to dominate with a 34.65% share in 2025, fueled by high-speed networking and 5G adoption [10] - Consumer electronics are projected to witness the fastest growth at a CAGR of 15.92%, driven by advanced smartphones and gaming systems [10] By Component - The Through Silicon Vias (TSVs) segment is projected to hold the largest share at 46.32% in 2025, known for better interconnections and lower power consumption [11] - The Through Glass Vias (TGVs) segment is expected to grow at the fastest CAGR of 15.16% due to superior electrical properties [12] Regional Insights - North America is expected to dominate the 3D IC market in 2025, accounting for 39.12% of revenue, driven by R&D in AI and cloud computing [13] - The Asia Pacific region is projected to experience the fastest growth from 2026 to 2033, with a CAGR of 15.45%, supported by a strong semiconductor manufacturing base [13] Leading Market Players - Key players in the 3D IC market include IBM, ASE Technology Holding Co. Ltd., STMicroelectronics, SAMSUNG, Taiwan Semiconductor Co. Ltd., TOSHIBA CORPORATION, Micron Technology Inc., MonolithIC 3D Inc., Intel Corporation, TEZZARON, Amkor Technology, Jiangsu Changdian Technology Co. Ltd., and United Microelectronics Corporation [5]

Core Viewpoint - The article discusses the divestiture of Synopsys' Optical Solutions Group and PowerArtist business to Keysight Technologies as a necessary step for regulatory approval of Synopsys' acquisition of Ansys, which was completed on July 17, 2025. The divestiture is expected to be finalized around October 17, 2025, and is not anticipated to have a significant financial impact on Synopsys [1][4]. Group 1: Synopsys' Divestiture - Synopsys has received all necessary approvals to proceed with the divestiture of its Optical Solutions Group (OSG) and PowerArtist business to Keysight Technologies, which is seen as essential for the regulatory approval of the Ansys acquisition [1][4]. - The OSG provides design tools and services for high-precision optical product simulation and visualization, including tools like CODE V, LightTools, LucidShape, RSoft, and the recently launched ImSym [2][3]. - The divestiture is expected to allow for a seamless transition for employees, customers, and partners, with OSG continuing to operate as part of Synopsys until the transaction is completed [3][4]. Group 2: Keysight Technologies' Acquisition - Keysight Technologies aims to expand its software simulation product portfolio through the acquisition of Synopsys' Optical Solutions Group, enabling support for high-performance systems beyond electronics, including optics and photonics [3][5]. - The acquisition of PowerArtist, a comprehensive RTL power design platform, is intended to enhance Keysight's position in high-performance system design and simulation software [4][5]. - Both Synopsys and Ansys believe that the sale of PowerArtist is necessary for regulatory approval, and the transition will be managed to ensure continuity of service for customers [4][5].

Core Insights - Selecting a reliable software development company is crucial for project success in the business environment [1] - The article provides a curated list of quality software development companies based on market feedback and technical service capabilities [1] Company Summaries - **Beijing Huasheng Henghui Technology Co., Ltd.**: Specializes in custom software development with extensive experience in military, government, and enterprise projects. Core service areas include military software, industrial software, safety production, digital transformation, and applications in new energy, education, and healthcare [3] - **Beijing Wumu Hengrun Technology Co., Ltd.**: Focuses on information technology solutions for military and state-owned enterprises, offering comprehensive services in military software, education and healthcare software, and digital transformation [4] - **Moore Dimension Technology Co., Ltd.**: A high-tech company in Xi'an specializing in artificial intelligence, with expertise in deep learning, natural language processing, and computer vision. It serves various industries including military, aerospace, manufacturing, finance, e-commerce, education, and healthcare [5] - **Microsoft**: A leading global software company with a product line that includes Windows, Office, and Azure. It is recognized for its advancements in AI, machine learning, and big data analytics [5] - **Google**: Known for its search engine, Google excels in software development with products like Android, Chrome, and Gmail, and has made significant breakthroughs in AI and cloud computing [5] - **Apple**: Renowned for its design and user experience, Apple offers core software including iOS and macOS, ensuring high-quality user experiences [6] - **IBM**: A century-old technology company with deep expertise in hardware, software, cloud computing, and AI, focusing on scalable technology platforms for enterprises [6] - **Oracle**: A leading enterprise software provider known for its database, ERP, and CRM solutions, addressing data storage, big data analytics, and enterprise management needs [7] - **SAP**: A top provider of enterprise management software, particularly in the ERP sector, helping businesses automate and optimize management processes [7] - **Autodesk**: The largest design, engineering, and entertainment software company globally, with AutoCAD dominating the architectural market [8] - **ANSYS**: A leading provider of engineering simulation software, widely used in industries such as nuclear, rail, oil and gas, aerospace, and mechanical manufacturing [9] - **Siemens**: A German technology giant focusing on industrial automation, digital factories, and IoT technologies, providing comprehensive digital solutions [10] - **NVIDIA**: A well-known graphics processing company, recognized for its GPUs that are essential for deep learning and AI applications [10] Selection Summary - Companies should consider project type, budget, and technical depth when selecting a software development partner. The listed companies have distinct strengths, emphasizing the importance of choosing a reliable partner that understands business needs [12]

Core Insights - The EDA industry is experiencing a merger wave driven by artificial intelligence (AI), with companies aligning their strategies towards AI integration [1][6] - Synopsys' acquisition of Ansys for $35 billion marks the largest merger in EDA history, expected to enhance market reach and capabilities significantly [1][2] - The trend of expanding EDA capabilities into high-end manufacturing sectors like automotive and aerospace is evident, as companies seek to leverage simulation technologies [2][3] EDA Industry Mergers - Synopsys' acquisition of Ansys is a pivotal move, as Ansys holds a 42% market share in simulation software, potentially increasing Synopsys' market size by 1.5 times [1][2] - Other notable acquisitions include Cadence's $1.24 billion purchase of BETA CAE Systems and Siemens EDA's $10.6 billion acquisition of Altair Engineering, indicating a broader trend of EDA firms expanding into non-semiconductor markets [2][3] AI Integration in EDA - The relationship between AI and EDA is evolving, with a shift from design process optimization to system-level optimization, driven by the complexities of modern chip architecture [3][4] - EDA companies are increasingly utilizing AI to enhance their system capabilities, which is crucial for supporting high-performance computing and AI applications [3][4] Challenges and Opportunities - The design verification process is moving earlier in the chip development cycle to mitigate risks and improve quality, necessitating advanced EDA tools [4][5] - The industry faces challenges such as data accessibility and the need for effective feedback mechanisms from end-users to improve AI model reliability [5][6] Future Trends in EDA - Predictions for the EDA industry include full-process intelligence, cross-scale collaboration, and continuous technological innovation, which will transform the role of engineers from operators to decision-makers [8][9] - The integration of AI in EDA tools is expected to enhance design analysis and performance evaluation, addressing issues like design errors and inefficiencies [7][8]

Group 1 - Thomson Reuters Corp will be added to the Nasdaq-100 Index and the Nasdaq-100 Equal Weighted™ Index on July 28, 2025, replacing ANSYS, Inc. [1] - ANSYS, Inc. will be removed from multiple Nasdaq indices, including the Nasdaq-100 Tech Sector™ Index and the Nasdaq-100 ESG™ Index, on the same date [2] - Thomson Reuters Corp will also replace ANSYS, Inc. in the Nasdaq-100 Tech Sector™ Index and other related indices on July 28, 2025 [2] Group 2 - Nasdaq is a leading global technology company that provides services to corporate clients, investment managers, banks, brokers, and exchange operators [4] - The company aims to enhance liquidity, transparency, and integrity in the global economy through its diverse offerings, including data, analytics, and software solutions [4]