Ansys Multiphysics Signoff Solutions Certified for Samsung's 2nm Power Backside Delivery Technology

Core Insights - Ansys power integrity platforms, specifically RedHawk-SC™ and Totem™, have been certified for Samsung's SF2Z 2nm manufacturing technology, enabling advanced semiconductor product design for various high-performance applications [2][3] Group 1: Technology and Certification - The certification of Ansys solutions allows early adopters to design leading-edge semiconductor products for high-performance computing (HPC), smartphones, artificial intelligence (AI), data center communication, and graphics processors [2] - Samsung's SF2Z technology features a power distribution network relocated to the backside of the chip, which saves space, reduces costs, and enhances performance [2][3] Group 2: Product Features - RedHawk-SC provides accurate signoff verification for electromigration and voltage drop (IR drop) on power distribution networks for digital designs, while Totem offers comprehensive evaluation for analog and mixed-signal designs [3] - Both platforms aim to reduce project risk, improve reliability, and extend the longevity of chips [3] Group 3: Collaboration and Commitment - Samsung Foundry and Ansys have collaborated closely to ensure mutual customers have timely access to necessary design tools, addressing challenges in digital, full-custom, mixed-signal, and 3D-IC designs [3] - The partnership emphasizes the commitment of both companies to deliver technology solutions that meet semiconductor technology needs, enhancing the user experience for joint customers [3]