Broadcom Delivers Industry Leading 200G/lane DSP for Gen AI Infrastructure

Core Insights - Broadcom Inc. has announced the general availability of Sian™2, a 200 Gbps per lane PAM-4 DSP PHY, which enhances the existing Sian DSP by supporting both 100 Gbps electrical and 200 Gbps optical interfaces [1][2] - The Sian2 DSP is designed to meet the growing demands of AI clusters, providing high performance, low latency, and resilient connectivity, which are essential for scaling AI workloads [2][3] Product Features - Sian2 is a low power 5nm 200G/lane DSP solution that enables sub-28W 1.6T transceivers and supports both 800G and 1.6T pluggable modules [5] - It offers data rates of 212.5-Gb/s and 226.875-Gb/s for InfiniBand and Ethernet applications, along with multiple FEC options [5] - The product features sub-80ns roundtrip latency, making it suitable for AI and machine learning applications [5] Market Demand - The demand for optical modules using 200G/lane is expected to ramp up significantly in 2025, with projections of over 1 million units of 1.6T optical transceivers needed within the first year [4] - This rapid demand highlights the competitive landscape in the AI sector, where companies are racing to establish dominance [4] Industry Collaboration - Broadcom's Sian2 DSP is being showcased at the ECOC Exhibition 2024, demonstrating its capabilities in high-speed optical transceivers for next-generation networking solutions [6] - Collaborations with companies like Eoptolink and InnoLight are emphasized, focusing on innovative designs and manufacturing capabilities to meet the growing bandwidth requirements in AI networks [6] Availability - Broadcom is currently sampling the Sian2 BCM8582X device to early access customers and partners, indicating a proactive approach to market entry [7]