TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

Core Insights - Ansys and TSMC have expanded their collaboration to enhance 3D-IC design productivity using AI-driven solutions, focusing on multiphysics analysis for advanced semiconductor technologies [2][10] - The partnership aims to develop innovative workflows for analyzing 3D-IC, photonic, electromagnetic, and radio frequency designs, which are essential for high-performance computing, AI, and data communication [2][3] Productivity Enhancement with AI - Ansys' AI-driven solutions improve productivity in designing 3D-IC components by automating critical tasks, thus reducing design costs and time-to-market [2][3] - The integration of Ansys optiSLang and RaptorX EM solver allows for quicker identification of optimal design configurations, minimizing the number of electromagnetic simulations required [3] Multiphysics Analysis for Reliability - TSMC is enhancing its collaboration with Ansys to incorporate thermal and mechanical stress analysis into 3D-IC packaging technologies, ensuring reliability in multi-chip manufacturing [5] - The joint development of a multiphysics analysis flow addresses challenges in timing, thermal, and power integrity, helping customers improve power, performance, and area (PPA) [5] COUPE Solution Enablement - TSMC's COUPE technology stacks electronic chips on photonic chips, and Ansys is working to enable a design solution that integrates various physics capabilities for optical data communication [7] - The collaboration includes advanced simulation tools for photonic devices and power delivery networks, ensuring design integrity and performance [8] A16 Enablement - TSMC's new A16 silicon process features innovative backside power contact technology, suitable for AI and HPC applications, with a focus on thermal management for reliability [9] - Ansys is collaborating with TSMC to provide accurate thermal analysis and enhance power integrity and reliability for the A16 process [9]