TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

Ansys AI technology improves 3D-IC design productivity, while the broader collaboration advances innovative 3D-IC thermal, mechanical stress, and photonic solutions for AI, HPC, and high-speed data communication semiconductors/ Key HighlightsAnsys artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasksAnsys multiphysics platform supports TSMC customers' reliability analysis need ...