ANSYS' Solution Used by Faraday for Multi-Die 2.5D/3D-IC Designs

Core Insights - Ansys Inc.'s multiphysics analysis solutions are utilized by Faraday Technology Corporation for developing advanced designs for multi-die 2.5D/3D integrated circuits, enhancing product performance, reliability, and power efficiency [1][2] - Faraday has launched a new 2.5D/3D-IC advanced package service to address the growing demand in sectors like AI, IoT, and 5G, while also tackling challenges related to signal integrity and power distribution [2][3] - The collaboration between Faraday and Ansys emphasizes the importance of advanced simulation tools in the semiconductor industry, particularly with the integration of Ansys RaptorX for accurate EM modeling [3][4] Company Developments - Ansys maintains a strong position in the high-end design simulation software market, driven by demand in the automotive and high-tech sectors, and has strengthened its collaboration with TSMC to enhance semiconductor technologies [4][5] - A joint effort among Ansys, TSMC, and Microsoft has resulted in a 10X speed-up in photonic simulations, showcasing the effectiveness of using advanced computing technologies [5] - In the last reported quarter, Ansys' revenues increased by 20% year over year to $594.1 million, exceeding estimates, largely due to significant contracts in the automotive and high-tech industries [5][6] Market Position - Ansys currently holds a Zacks Rank of 3 (Hold), with its stock gaining 10.5% over the past year, compared to a 33% growth in the sub-industry [7]