TSMC Recognizes Ansys for Excellence in Design Enablement for AI, HPC, and Photonics Silicon Systems

Ansys won four TSMC 2024 OIP Partner of the Year awards, highlighting excellence in multiphysics analysis solutions for system design using advanced silicon processes and the rapidly evolving 3D-IC and silicon photonics packaging technologies/ Key Highlights Ansys multiphysics analysis solutions are critical to the successful integration and performance of advanced multi-chip packaging and electronic and photonic co-packaged optics in TSMC's compact universal photonics engine (COUPE) Ansys' joint developme ...