E&R: Taiwan's Leading Semiconductor Equipment Supplier Driving Advanced Packaging Innovation

Company Overview - E&R Engineering Corp. is a Taiwan-based semiconductor equipment manufacturer with 30 years of expertise, supplying over 500 advanced semiconductor packaging tools to major OSATs worldwide [1] - The company specializes in laser and plasma solutions, offering technologies such as marking, scribing, grooving, and wafer ID/backside marking [1] Product Offerings - E&R provides high-performance solutions for advanced packaging platforms including FCBGA, FCCSP, Fan-Out, and Fan-In (Wafer Level Packaging) [2] - The Flip Chip BGA solutions include pre-flip chip die bond plasma cleaning, pre-molding/underfill plasma cleaning, and on boat/tray laser marking for traceability [2] - For FOPLP processes, E&R offers reliable, mass-production equipment supporting panel sizes from 300 × 300 mm to 700 × 700 mm, featuring excellent warpage handling capabilities of up to 16 mm [3] Service and Support - E&R has service teams located in Portland, Arizona, and New Mexico, providing fast after-sales support to minimize downtime and maximize production efficiency [4] - The company offers comprehensive technical support, remote diagnostics, and customized training to reinforce its reputation as a trusted partner for semiconductor manufacturers worldwide [4] Industry Trends - As demand for high-performance semiconductor packaging grows, E&R drives innovation in Advanced Packaging with high-precision laser and plasma solutions, enhancing efficiency, yield, and reliability for North American and European manufacturers [5] - The company supports localized supply chain resilience in the semiconductor industry [5]