公众号记得加星标⭐️，第一时间看推送不会错过。 现在，HBM（高显存显存）几乎成了人们热议的话题。股票论坛、新闻媒体、甚至餐桌上，到处都 在谈论它——"HBM 供应短缺"或者"NVIDIA 因为 HBM 的缘故，GPU 产能不足"。 但几乎没有人解释它究竟难在哪里。大多数报道都止步于"他们用 TSV（硅通孔）堆叠芯片"或者"微 凸点必须完美对齐"。这算不上解释，只是简单的说明而已。 本文将详细介绍 HBM 生产的每个阶段——设计、制造、测试、封装——并解释每个阶段的真正难点 所在。文章还会涵盖产品交付给客户之后的情况，因为那才是真正出乎意料的有趣之处。本文所有内 容均基于亲身经历和公开的技术资料。 设计：不仅仅是堆叠式DRAM 总线宽度问题 标准的DDR5接口宽度为64位。HBM3E的运行宽度为1024位。HBM4则将其提升至2048位。更宽的 总线宽度不仅仅意味着更多的导线——每个I/O引脚都需要独立的信号通路，而且考虑到电源和控制 信号，单个HBM3E或HBM4堆叠就需要与相邻的GPU建立超过一千个连接。 你无法在PCB上实现这种布线。几何结构不兼容。这就是硅中介层存在的根本原因，也是像CoWoS 这样的 ...

记者丨张嘉钰 编辑丨曾静娇 周一（3月9日），美国三大股指全线收涨。道指涨0.5%；标普500指数涨0.83%，盘中一度跌超1.5%；纳指涨1.38%，基本收复自伊朗冲突以 来的全部跌幅。 据央视新闻报道， 特朗普称美国对伊朗战事已基本结束 。 | 道琼斯工业 | 纳斯达克指 | 标普500 | | --- | --- | --- | | 47740.80 22695.95 | | 6795.99 | | +239.25 +0.50% +308.27 +1.38% +55.97 +0.83% | | | | 美国科技七 中概科技龙 | | 中国金龙 | | 62299.79 3817.94 | | 7083.84 | | +812.56 +1.32% +80.23 +2.15% +122.79 +1.76% | | | | 道琼斯期货 纳斯达克100 标普500期货 | | | | 47660 24914.25 | | | | -109 - -0.23% -76.75 -0.31% -18.50 -0.27% | | | 大型科技股集体上涨，万得美国科技七巨头指数涨1.32%。英伟达、谷歌A涨超2% 。 半导 ...

Core Insights - The AI revolution may face significant risks not from technology itself but from vulnerabilities in global shipping routes, particularly energy supply chains [1] - Nvidia designs AI chips, but their manufacturing is reliant on Taiwan Semiconductor Manufacturing Company (TSMC), highlighting a dependency on Taiwan for the AI supply chain [2] - Taiwan's energy imports, which account for approximately 97-98% of its needs, are heavily reliant on routes that pass through the Strait of Hormuz, creating a potential risk for the semiconductor industry [3] Energy Dependency - The semiconductor industry in Taiwan, like South Korea, is highly vulnerable to energy supply disruptions due to its reliance on imported energy [3][4] - Recent geopolitical events have shown how quickly semiconductor stocks can react to perceived threats to energy supplies, as seen in South Korea's market response [4] - The AI boom is heavily financed, but the production of chips at TSMC requires substantial and continuous energy, emphasizing the critical nature of energy supply for the AI supply chain [5]

And it's time for the big three. We've got three stocks, three charts, and three trades for you today. Rick Dat of course will take us through the charts.And here to take us through the trades today, Scott Bowerer, the CEO over at Prosper Trading Academy. Scott, great to have you with us. You know, a bit of a wild day.We are off of session lows, but still, you know, firmly trading down in the red here. A lot of concerns about oil prices. We're we're right about 100.I think we dipped under we're dipping unde ...

如果您希望可以时常见面，欢迎标星收藏哦~ 人工智能（AI）芯片需求快速攀升，使半导体产业的先进封装技术成为关键环节。市场传出，因 台积电先进封装CoWoS产能长期吃紧，部分AI芯片客户开始评估其他方案，英特尔主打的EMIB 封装技术因此受到关注。外媒近日报导指出，相关合作案规模上看每年数十亿美元，显示先进封装 市场竞争正逐渐升温。 根据Wccftech等外媒报导指出，随着AI运算需求持续扩大，高效能芯片不仅依赖先进制程，封装 技术同样攸关效能表现。其中台积电CoWoS封装可整合GPU与高频宽记忆体（HBM），提供高速 资料传输能力，已成为多家AI芯片设计公司采用的关键技术，但在AI需求爆发下，CoWoS产能长 期满载，短期内供应仍相对紧绷。 由于大型云端服务供应商（CSP）积极开发自有AI芯片，让先进封装重要性不亚于晶圆制造。市场 传出，包括英伟达（NVIDIA）、Google及Meta在内的科技巨头，开始评估在下一代AI ASIC或 加速器中导入英特尔的方案，先进封装竞局或将成形。 （来源：半导体芯闻综合 ） *免责声明：文章内容系作者个人观点，半导体芯闻转载仅为了传达一种不同的观点，不代表半导体芯闻对该 ...

半导体先进封装产业解读 20260308 摘要 先进封装已成为超越摩尔定律的关键路径，通过倒装、TSV、RDL 等技 术解决 7nm 以下制程漏电功耗高、成本指数级增长及算力传输损耗等 物理瓶颈。 CoWoS-S 凭借硅中介层与 TSV 实现高性能互联，是 NVIDIA H100/A100 及 AMD MI300 等旗舰 AI 芯片的主流方案，但成本较高。 CoWoS-L 通过硅桥局部互联平衡性能与成本，目前在台积电为英特尔 提供的 2.5D 封装中占比约 60%，是未来超大尺寸 AI 芯片及国内华为升 腾、寒武纪等工艺迁移的方向。 CoPoS 技术以矩形面板替代圆形硅中介层，可将材料利用率从 70%- 75%提升至 100%，台积电计划 2026 年试产、2027 年量产，盛合晶 微、长电、甬矽处于调研打样阶段。 国内现阶段 CoWoS 形态严格意义上属于 2.5D 水平集成，长电科技 XDFOI 已布局类似 2.5D CoWoS 形态，而 3D 垂直集成（如 HBM）仍 需中介层具备功能性实现。 CoWoP 旨在取消昂贵的基板环节，直接将芯片组合安装至 PCB，但受 限于热膨胀系数差异及信号线宽要求，目前 ...

公众号记得加星标⭐️，第一时间看推送不会错过。 随着20层高带宽存储器（HBM）堆叠技术的商业化进程日益临近，关于放宽国际半导体标准的讨论 也愈发激烈。 据业内人士8日透露，在近期举行的纳什维尔联合电子器件工程委员会（JEDEC）会议（JC-42） 上，一项重要议题便是将HBM产品的高度放宽至800微米或更高。JEDEC三月会议旨在完善去年的草 案，并协调今年的关键下一代标准技术。 随着堆叠层数的增加，HBM的标准高度一直在不断调整。此前，国际标准已从725微米放宽至775微 米，但为了应对20层堆叠工艺的物理限制，进一步放宽至800微米或更高也在考虑之中。 为了满足现有的 20 层堆叠 775 微米标准，必须采用背面研磨工艺，将单个 DRAM 芯片加工得极其 薄。这一工艺增加了晶圆损坏的风险，进而导致整体良率大幅下降。作为 此外，业界正在讨论放宽下一代HBM（例如HBM4E和HBM5）的标准厚度，这些芯片采用20层堆叠 式DRAM。目前讨论的厚度范围从825微米到900微米以上。如果最终确定900微米以上的标准，预计 将远超以往的增幅。 一位半导体行业内部人士表示："JEDEC 必须在产品商业化前一到一年半 ...

Group 1: Taiwan Semiconductor Manufacturing (TSMC) - TSMC is positioned as a leading player in the AI infrastructure boom, primarily through its manufacturing of advanced chips, particularly logic chips [2][5] - The company has established a virtual monopoly in manufacturing advanced chips at small nodes due to its technological expertise and scale, while competitors struggle with high yields [4] - TSMC is expected to benefit significantly from the AI data center boom as it will be the main manufacturer of GPUs and other AI chips, as well as advanced CPUs [5] Group 2: ServiceNow - ServiceNow is recognized as a key player in the SaaS sector, which may outperform in the coming years despite current market perceptions [7] - The company's platform integrates customer data with workflows, making it invaluable and difficult to replace due to its custom business logic and security protocols [8] - ServiceNow's generative AI suite, Now Assist, has gained popularity, and its new Control Tower aims to position the company as a leader in agentic AI orchestration [10][11]

RT NoRegrets (@NoRegretNoGain)EVERYONE THINKS THE STRAIT OF HORMUZ IS ABOUT OIL. IT'S NOT. IT'S ABOUT EVERYTHING YOU NEED TO SURVIVE.The Strait has been closed for 8 days. People see oil prices and panic.They have NO idea what's actually at stake.Let that sink in.💀 92% of the world's SULFUR comes from refining oil and gas💀 Sulfur → sulfuric acid → the SINGLE most produced chemical on Earth💀 Sulfuric acid is how we extract COPPER💀 Sulfuric acid is how we extract COBALT💀 No sulfuric acid = no transformers, no ...

Group 1 - TSMC announced the launch of its 2026 campus recruitment activities, aiming to hire approximately 8,000 new employees, including engineers and technicians, to support business growth and technology development [2] - The average annual salary for new graduate engineers with a master's degree is expected to reach NT$2.2 million [2] - TSMC's recruitment will cover various locations in Taiwan, including Taoyuan, Hsinchu, Miaoli, Taichung, Chiayi, Tainan, and Kaohsiung, and will target graduates from diverse fields such as electrical engineering, electronics, optics, physics, materials, chemistry, chemical engineering, mechanical engineering, computer science, and management [2] Group 2 - TSMC is also launching the 2026 DNA Summer Internship Program, inviting students in their third year or above (preferably master's and doctoral candidates) to apply, with the application deadline set for May 8, 2026 [3] - The internship program offers practical experience and career navigation, with outstanding performers having the opportunity for pre-employment in the semiconductor industry [3] - TSMC emphasizes that talent is its most important asset and is committed to providing quality job opportunities and competitive compensation, while fostering an inclusive work environment that encourages diversity [3]