芯碁微装：订单交付计划已排产至2025年第三季度 当前产能超载

Group 1 - The global demand for AI computing power is driving the accelerated upgrade and increased production of high multi-layer PCB boards and high-end HDI industry [1] - The PCB industry chain is expanding overseas, with the company's current order delivery plan scheduled until the third quarter of 2025, indicating that production capacity is currently overloaded [1] - The company is fully promoting the construction of its second-phase base, aiming for it to be operational by mid-2025 to ensure timely delivery [1]