STMicroelectronics to enable higher-performance cloud optical interconnect in datacenters and AI clusters

Core Insights - STMicroelectronics is launching next-generation proprietary technologies for high-performance optical interconnects aimed at datacenters and AI clusters, addressing the growing demands of AI computing [2][4] - The new silicon photonics and BiCMOS technologies are set to be available in the second half of 2025, supporting 800Gb/s and 1.6Tb/s optical modules [2][5] Company Developments - ST's proprietary silicon photonics technology will enable the integration of multiple complex components into a single chip, while the next-gen BiCMOS technology will provide ultra high-speed and low power optical connectivity [3][4] - The manufacturing of these technologies will occur on 300mm processes in Europe, ensuring a high-volume supply for optical module development [4][5] Market Trends - The Pluggable Optics for Data Center Market is projected to grow from $7 billion in 2024 to over $24 billion by 2030, with a CAGR of 23% [5] - The market share of transceivers based on silicon photonics modulators is expected to increase from 30% in 2024 to 60% by 2030 [5] Collaborations - STMicroelectronics is collaborating with AWS to develop a new silicon photonics technology, PIC100, aimed at enhancing interconnection capabilities for various workloads, including AI [4]