STMicroelectronics announces timing for fourth quarter and full year 2025 earnings release and conference call Geneva – January 7, 2026 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced today that it will release its fourth quarter and full year 2025 earnings before the opening of trading on the European Stock Exchanges on Thursday, January 29, 2026. The press release will be available immediately after the release on ...

每年的CES，都是芯片厂商集中发新品和"秀肌肉"的好机会。今年CES，芯片厂商有什么新品展示和看点？EEWorld今天盘点一下。 TI：连发三款汽车新品 论颠覆，TI（德州仪器）绝对榜上有名。此次CES，TI针对汽车发了三款极为强大的产品：L3的跨域融合SoC TDA5系列、单芯片8发8收雷达发射器 AWR2188、全新10BASE-T1S以太网串行外设接口PHY DP83TD555J-Q1。 跨域融合是汽车SoC当前发展的重点。TDA5算力极为强大，实现了单芯片跨域融合ADAS、IVI及网关应用，最高1200TOPS，能效比超 24 TOPS/W。搭载 8个最新的Cortex-A720AE车规CPU内核、6个Arm Cortex-R52+、Imagination的DXS系列GPU，还搭载了TI最新一代C7 NPU，AI算力较前代产品最高可提 升 12倍。同时采用UCIe接口 （Chiplet），扩展性非常强大。开发方面，TI 正与新思科技 (Synopsys) 合作推出 TDA5 SoC 虚拟开发套件。 单芯片4D雷达TI一直是领跑者，AWR2188是业界首个单芯片8发8收的方案，支持卫星式架构与边缘式架构 ...

After opening flat, France's equity benchmark CAC 40 drifted lower Tuesday morning with investors digesting the nation's inflation and PMI data, and making largely cautious moves.The index was down 49.25 points or 0.6% at 8,162.25 a little before noon.Legrand and Dassault Systemes tumbled 3.7% and 3.6%, respectively. Capgemini and Saint Gobain lost a little over 3%, and Bureau Veritas drifted down 2.1%.BNP Paribas, Hermes International, Schneider Electric, Publicis Groupe, LVMH, Air Liquide, Accor and Soci ...

声明：市场有风险，投资需谨慎。本文为AI基于第三方数据生成，仅供参考，不构成个人投资建议。 本文源自：市场资讯 国家知识产权局信息显示，意法半导体股份有限公司取得一项名为"压控振荡器及其使用方法"的专利， 授权公告号CN116248047B，申请日期为2022年12月。 作者：情报员 ...

格隆汇1月6日｜花旗银行分析师在报告中写道，美国半导体公司微芯科技上调第三季度业绩指引，对欧 洲同行英飞凌和意法半导体而言是一个积极信号。分析师表示，近几个月半导体供应下滑，而微芯科技 指出的需求高于平均水平，这对欧洲半导体企业构成了明显的利好映射。分析师补充称，半导体公司有 望迎来反弹，欧洲企业最新的季度营收有潜力超出预期，并改善其2026年的业绩前景。受此影响，英飞 凌股价上涨3.95%，而意法半导体在米兰和巴黎市场的涨幅均在2.5%左右。 ...

Core Viewpoint - The embedded computing world is undergoing a transformation where AI is reshaping the architecture of MCUs, moving from traditional designs to those that natively support AI workloads while maintaining reliability and low power consumption [2][5]. Group 1: MCU Evolution - The integration of NPU in MCUs is driven by the need for real-time control and stability in embedded systems, particularly in industrial and automotive applications [3][4]. - NPU allows for "compute isolation," enabling AI inference to run independently from the main control tasks, thus preserving real-time performance [3][5]. - Current edge AI applications typically utilize lightweight neural network models, making hundreds of GOPS sufficient for processing, which contrasts with the high TOPS requirements in mobile and server environments [5]. Group 2: Major MCU Players' Strategies - TI focuses on deep integration of NPU capabilities in real-time control applications, enhancing safety and reliability in industrial and automotive scenarios [7][8]. - Infineon leverages the Arm ecosystem to create a low-power AI MCU platform, aiming to reduce development barriers for edge AI applications across various sectors [9][10]. - NXP emphasizes hardware scalability and a full-stack software approach with its eIQ Neutron NPU, targeting diverse neural network models while ensuring low power and real-time response [11][12]. - ST aims for high-performance edge visual applications with its self-developed NPU, pushing the boundaries of traditional MCU AI capabilities [13][14]. - Renesas combines high-performance cores with dedicated NPU and security features, focusing on reliable edge AIoT applications [15][16]. Group 3: New Storage Technologies - The introduction of NPU in MCUs necessitates a shift from traditional Flash storage to new storage technologies that can handle the demands of AI workloads and frequent updates [17][18]. - New storage solutions like MRAM, RRAM, PCM, and FRAM are emerging to address the limitations of Flash, offering advantages in reliability, speed, and endurance [21][22][25][28][30]. - MRAM is particularly suited for automotive and industrial applications due to its high reliability and endurance, with companies like NXP and Renesas leading in its adoption [22][23][24]. - RRAM offers benefits in speed and flexibility, making it a strong candidate for AI applications, with Infineon actively promoting its integration into next-generation MCUs [25][26][27]. - PCM provides high storage density and efficiency, suitable for complex embedded systems, with ST advocating for its use in advanced MCU designs [28][29]. Group 4: Future Implications - The dominance of Flash storage is being challenged as new storage technologies demonstrate superior performance and reliability for embedded systems [33]. - The integration of NPU and new storage technologies in MCUs represents a shift towards system-level optimization, enhancing overall performance and efficiency [33]. - The transformation in the MCU market presents structural opportunities for domestic manufacturers to innovate and compete against established international players [33].

Core Viewpoint - The article emphasizes the importance of participating in international exhibitions, particularly the electronica in Munich, as a means for companies in the chip industry to expand their horizons and gain insights into global market trends and opportunities [3][6]. Group 1: Industry Challenges - The current major pain point for many companies in the chip distribution sector is intense competition and price pressure from domestic clients, leading to thin profit margins [6][7]. - Many businesses are caught in a cycle of effort without substantial returns, indicating that the issue lies not in hard work but in strategic direction [10][11]. Group 2: Benefits of International Exposure - Traveling abroad, particularly to Europe, allows companies to witness different stages of industrial development and gain insights that can be applied to their own operations [12][13]. - Direct interactions with potential partners and clients during international trips can lead to meaningful business relationships and collaborations [18][25]. Group 3: Upcoming Opportunities - The 2026 European study tour will include visits to Germany and France, focusing on deep engagement with local industries and institutions [27][37]. - The tour will feature two packages: a basic package aimed at cost-effectiveness and a premium package offering exclusive experiences and networking opportunities [28][34]. Group 4: Tour Highlights - The itinerary includes participation in the electronica exhibition, visits to key semiconductor companies, and interactions with top universities and research institutions [40][44]. - The tour aims to provide a comprehensive understanding of the European semiconductor landscape, enhancing participants' knowledge and business strategies [42][43].

Hardman Johnston Global Advisors, an investment management company, released its “Hardman Johnston Global Equity Strategy” investor letter for the third quarter of 2025. A copy of the letter can be downloaded here. The portfolio underperformed in the quarter due to stock selection. The composite returned 5.02%, net of fees, compared to 7.62% for the MSCI AC World Net Index. In addition, please check the fund’s top five holdings to know its best picks in 2025. In its third-quarter 2025 investor letter, Ha ...

Core Viewpoint - The article discusses the restructuring and layoffs at STMicroelectronics, highlighting the challenges faced by the semiconductor industry amid a market downturn and the company's strategic shift towards new business areas while managing employee concerns and project delays [1][2][4]. Group 1: Layoffs and Restructuring - STMicroelectronics announced a global layoff of 2,800 employees, with 1,000 planned layoffs in France by the end of 2027, amidst a restructuring effort [1]. - As of now, 370 employees have already left through placement and career planning programs [1]. - The closure of the 200mm wafer production line at the Crolles facility is a significant part of this restructuring [2]. Group 2: Market Conditions and Financial Performance - The microelectronics market is experiencing cyclical fluctuations, with STMicroelectronics facing a revenue decline of 23.2% year-on-year in 2024 and a further 15% drop in the first three quarters of 2025 [2]. - The company’s products cater to various industrial sectors, including energy, healthcare, automation, and electric vehicles [2]. Group 3: New Business Initiatives and Challenges - STMicroelectronics is venturing into new business areas such as chip packaging and wafer electrical testing, but these areas are more automated than the 200mm wafer production line [4]. - The "Liberty" expansion project aims to double the capacity of the 300mm wafer production but has faced delays due to issues in the public consultation phase [4][5]. Group 4: Project Delays and Investment Issues - Of the six planned production facilities for the expansion project, three are completed, but equipment delivery is significantly delayed [5]. - The project has received 70% of its planned investment, with production expected to start in 2024, although specific capacity details remain undisclosed [5]. - The partner, GlobalFoundries, has not fulfilled its investment commitments, causing further delays [5]. Group 5: Employee Concerns and Government Support - Recent announcements from GlobalFoundries regarding investments in Germany and the U.S. have heightened employee anxiety about job security at STMicroelectronics [7]. - The project was initially expected to create 1,000 jobs, but only about 250 have been created so far [7]. - The French government has begun disbursing subsidies, with a total potential of €1.05 billion, but delays in project progress have affected the release of funds [8].

Many semiconductor companies with heavy exposure to auto and industrial end-markets have underperformed since late 2023, but STMicroelectronics ( STM ) (“STMicro”) has been hit especially hard by specific customer exposures, share loss in its microcontroller business, and price pressure across its lines, with weakerAnalyst’s Disclosure:I/we have no stock, option or similar derivative position in any of the companies mentioned, and no plans to initiate any such positions within the next 72 hours. I wrote thi ...