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STMicroelectronics announces timing for third quarter 2025 earnings release and conference call
Globenewswire· 2025-10-03 13:00
STMicroelectronics announces timing for third quarter 2025 earnings release and conference call Geneva – October 3, 2025 – STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, announced that it will release third quarter 2025 earnings before the opening of trading on the European Stock Exchanges on October 23, 2025. The press release will be available immediately after the release on the Company’s website at www.st.com. STMicroele ...
Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology
Globenewswire· 2025-10-02 13:00
T4724D -- Oct 2 2025 -- ST-Tobii interior sensing technology_IMAGE ST-Tobii interior sensing technology Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology Starting mass production of an advanced interior sensing system for a premium European carmaker for enhanced driver and passenger monitoring Cost-effective single-camera solution combines Tobii's interior-sensing technology and ST’s imaging sensors to deliver wide-angle, high-quality imaging in daytime and n ...
STMicroelectronics (STM) Invests $60 Million to Boost Advanced Chip Production in France
Yahoo Finance· 2025-10-02 06:08
STMicroelectronics N.V. (NYSE:STM) ranks among the best cheap semiconductor stocks to buy. On September 17, STMicroelectronics N.V. (NYSE:STM) announced a $60 million investment in its Tours, France, plant, where it aims to create an experimental line for advanced semiconductor manufacturing technology. As part of a significant restructuring planned in October, the company has been transferring aging chipmaking lines away from Tours. Known as Panel-Level Packaging (PLP), the new technology enables STMicr ...
13份料单更新!出售ST、英飞凌、英特尔等芯片
芯世相· 2025-09-30 04:40
Core Viewpoint - The article discusses the challenges and opportunities in the semiconductor inventory market, highlighting the need for effective promotion and sales strategies for surplus materials while offering significant discounts to clear stock. Group 1: Inventory Management - A significant amount of obsolete materials is held in inventory, leading to monthly storage and capital costs of at least 5,000, resulting in a potential loss of 30,000 after six months [1] - The company has a smart warehouse with a total area of 1,600 square meters, housing over 5,000,000 chips valued at over 100 million [7] Group 2: Sales and Promotions - The company has served a total of 21,000 users and is actively discounting inventory, with transactions completed in as little as half a day [8] - There is a call to action for those struggling to sell their materials or seeking better prices to utilize the company's platform for surplus materials [9] Group 3: Product Offerings - The article lists various semiconductor products available for sale, including significant quantities of components from brands like ST, Infineon, and NXP, with some items reaching quantities of 152,000 [4][5] - Additionally, there are specific requests for certain components, indicating a demand for particular semiconductor models [6]
CAC 40 Flat In Lackluster Trade
RTTNews· 2025-09-29 11:36
French stocks are turning in a mixed performance in lackluster trade on Monday amid a lack of triggers. Investors are mostly cautious, looking ahead to some crucial economic data later in the week.Luxury stocks are finding some support.The benchmark CAC 40, moving between 7,872.29 and 7,901.23, was up 2.89 points or 0.04% at 7,873.57 a few minutes ago. Kering, STMicroElectronics, EssilorLuxottica, Hermes International, Eurofins Scientific, Stellantis and LVMH are gaining 1.1 to 1.8%.Thales is up nearly 1%. ...
7份料单更新!出售TI、ST、美信等芯片
芯世相· 2025-09-25 07:36
Core Insights - The article discusses the challenges of managing excess inventory in the semiconductor industry, highlighting the financial burden of storage and capital costs associated with unsold materials [1] - It promotes a service called "Chip Superman," which has served 21,000 users and offers rapid inventory clearance solutions [6] Group 1: Inventory Management - Excess inventory of 100,000 units incurs monthly storage and capital costs of at least 5,000, leading to a potential loss of 30,000 after six months [1] - The article emphasizes the difficulty in promoting and selling excess materials, suggesting that companies can seek assistance from Chip Superman for better pricing and faster transactions [1][7] Group 2: Inventory Offerings - Chip Superman has a smart warehouse of 1,600 square meters, with over 1,000 stock models and a total inventory of 50 million chips valued at over 100 million [6] - A list of available excess materials for sale is provided, including various brands and models, with quantities ranging from 960 to 105,000 units [4] Group 3: Purchase Requests - The article includes a request for specific components, indicating demand for certain models from brands like TI, LITEON, and ST, with quantities ranging from 3,000 to 50,000 [5] Group 4: Market Context - The article references broader market trends, including potential price increases from major manufacturers like TI and signs of recovery in the semiconductor sector based on recent financial reports [8]
STARLight Project chosen as the European consortium to take the lead in next-generation Silicon Photonics on 300mm wafers
Globenewswire· 2025-09-23 07:00
Core Viewpoint - The STARLight project aims to establish Europe as a leader in 300mm silicon photonics technology by developing high-volume manufacturing lines and application-driven solutions for key sectors such as datacenters, AI clusters, telecommunications, and automotive markets [1][3][7]. Group 1: Project Overview - The STARLight consortium, led by STMicroelectronics, has been selected by the European Commission under the EU CHIPS Joint Undertaking initiative [2]. - The project will run until 2028, focusing on creating innovative optical modules and a complete value chain for silicon photonics [1][3]. - The consortium includes 24 leading technology companies and universities from 11 EU countries [7]. Group 2: Technological Focus - Silicon photonics technology is essential for enhancing data transfer efficiency in datacenters and AI clusters, as well as in applications like LIDAR and space technologies [4]. - The project will develop advanced Photonic Integrated Circuits (PICs) to address challenges in high-speed data communication, targeting up to 200Gb/s for datacom applications [5][6]. - Key innovations will include high-speed modulators, efficient on-chip lasers, and the exploration of new materials for silicon photonics platforms [8]. Group 3: Industry Applications - In the datacenter sector, STARLight will create demonstrators based on PIC100 technology and develop prototypes for free-space optical transmission systems [5]. - For AI applications, the project aims to develop a photonic processor optimized for tensor operations, enhancing AI processing performance [9]. - In telecommunications, the project will focus on integrated switches for mobile networks and Radio over Fiber technology to improve data traffic handling [10]. Group 4: Automotive and Sensing - The project will also explore applications in automotive sensing, with partnerships aimed at integrating LiDAR technology into vehicles [11][12]. - THALES will develop sensors for signal processing, contributing to the broader ecosystem of autonomous robotics [12]. Group 5: Consortium Contributions - Major contributors like CEA-Leti, imec, and Soitec will leverage their expertise to advance silicon photonics technology and address industry challenges [14][15][18]. - The collaboration aims to enhance manufacturing quality, scalability, and reduce environmental impact in photonics applications [18][19].
STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption
Globenewswire· 2025-09-22 13:00
Core Insights - STMicroelectronics has joined the FiRa Consortium board, enhancing its commitment to the Ultra-Wideband (UWB) ecosystem and automotive Digital Key adoption [1][3][4] Group 1: UWB Technology Development - STMicroelectronics is actively involved in the development of the IEEE 802.15.4ab amendment, which aims to improve UWB system performance and expand its application scope [2] - The evolution of UWB standards is expected to deliver significant enhancements, including centimeter-level accuracy, improved security, and reduced power consumption, which are essential for various applications such as automotive access and smart home automation [2][5] - Key advancements in UWB specifications are addressing critical scenarios, such as reliably detecting a key or phone in a user's back pocket, ensuring seamless user experiences [6] Group 2: Strategic Participation and Vision - Rias Al-Kadi's appointment to the FiRa board signifies STMicroelectronics' deepening commitment to UWB technology and its mission [3][4] - The company is engaged in standardization and certification across major UWB groups, supporting the evolution of UWB technology to enhance user experiences and lower system costs, particularly in consumer and automotive access applications [4] - STMicroelectronics aims to foster a robust UWB ecosystem that provides seamless, secure, and cost-effective solutions for the growing UWB market [4] Group 3: Industry Impact and Applications - UWB technology is recognized for its high resistance to interference and is supported by the latest smartphones, enhancing applications such as smart appliance interaction and device tracking [5] - Automotive applications of UWB include digital car keys that localize the key in relation to the vehicle and vehicle occupant detection to improve safety [5]
意法半导体全球PLP市占率突破30%,即将再建最新产线
势银芯链· 2025-09-19 07:27
"宁波膜智信息科技有限公司"为势银(TrendBank)唯一工商注册实体及收款账户 重要会议: 11 月 17-19 日,2025势银异质异构集成年会(浙江·宁波) 点此报名 11月19日-21日,2025势银显示技术与供应链产业年会(四川·成都) 点此报名 添加文末微信,加 异质异构集成产业 群 在封装技术的发展历程中 ,晶圆级封装 (WLP) 和倒装芯片技术 是近十年来应用的主流技术手段。 然而,随着器件尺寸越来越小、越来越复 杂,这些方法在可扩展性和成本效益方面已开始达到极限 , 开发 更为先进或局限性更小的技术路线已成为了当下亟待突破之事 。 其中, PLP 是一种先进的自动化芯片封装和测试工艺技术,可提高生产效率并降低成本,是打造下一代更小、更强大、更具成本效益的电子 设备的关键技术。 且 PLP 中的大面积载体(用大尺寸矩形晶圆代替圆形晶圆)可提高生产吞吐量,使其成为更高效的大批量生产解决方 案。 而 面板级封装 (PLP-DCI) 是一种将多个 IC 封装在单个更大的矩形基板上,而不是单个圆形晶圆上的方法。这种方法可以同时处理更多 IC,从而降低成本并提高产量。 同时 PLP-DCI 还允许在高 ...
欧洲半导体股延续涨势,阿斯麦、ASM国际、意法半导体、爱思强涨幅介于4.7%-7.2%
Mei Ri Jing Ji Xin Wen· 2025-09-18 11:24
每经AI快讯,9月18日,欧洲半导体股延续涨势,阿斯麦(ASML)、ASM国际(ASM International)、意法 半导体(STMicro)、爱思强(Aixtron)涨幅介于4.7%-7.2%。 ...