芯原股份18亿元定增项目注册生效

Core Viewpoint - The registration of the 1.807 billion yuan private placement project by Chiplet Co. has been approved, aimed at funding R&D projects in AIGC and smart mobility sectors, enhancing the company's capabilities in semiconductor IP and Chiplet solutions [1][2]. Group 1: Fundraising and Project Purpose - The company plans to raise no more than 1.807 billion yuan for R&D projects related to AIGC and new generation IP development [1]. - The Chiplet project targets market demands in data centers and smart mobility, allowing the company to upgrade to a Chiplet supplier while maintaining its semiconductor IP licensing business [1][2]. Group 2: Market Position and Performance - Chiplet Co. holds the largest market share in China's semiconductor IP licensing business and ranks eighth globally as of May 2024 [2]. - From 2020 to 2022, the company achieved a compound annual growth rate of approximately 33% in revenue, with a notable performance in 2022 [2]. Group 3: Financial Performance and Recovery - Despite a challenging industry environment, the company maintained positive net profits in the first half of 2023, with revenue showing signs of recovery in 2024 [3]. - In Q3 2024, the company's revenue reached a record high for that quarter, growing by 23.60% year-on-year, with an expected overall revenue for 2024 remaining stable compared to 2023 [3]. Group 4: Orders and R&D Investment - As of the end of 2024, the company had 2.406 billion yuan in hand orders, marking a 13% increase from the previous quarter [4]. - R&D expenses are projected to increase by approximately 32% in 2024, reflecting a strategic focus on enhancing R&D during the industry downturn [4].