Broadcom Extends 200G/lane DSP PHY Leadership for Next-Generation AI Infrastructure

Core Insights - Broadcom has introduced Sian3 and Sian2M, expanding its 200G/lane DSP PHY portfolio to meet the connectivity demands of AI/ML clusters [1][2] - The new DSPs focus on optimizing power consumption for both single-mode fiber (SMF) and short-reach multi-mode fiber (MMF) links in 800G and 1.6T optical transceiver applications [1][2] Product Highlights - Sian3 is a 3nm 200G/lane PAM4 DSP PHY that achieves the lowest power consumption in the industry for 800G and 1.6T optical transceivers, offering over 20% power reduction compared to previous models [3][6] - Sian2M integrates VCSEL drivers and is designed for short-reach MMF links, enhancing performance and efficiency for AI clusters [4][6] - Broadcom's DSPs are complemented by a portfolio of 200G/lane lasers, which are already in volume production, ensuring quality and reliability for AI optical interconnects [5][6] Market Context - The demand for increased bandwidth and interconnect density in AI clusters is driven by the rapid growth of AI workloads, with optical interconnect power being a key limiting factor for scalability [2][6] - By 2028, the market for PAM4 DSPs is expected to exceed $1 billion, driven by the transition to next-generation 102T switch systems [6] Technical Specifications - Sian3 supports data rates of 212.5-Gb/s and 226.875-Gb/s for InfiniBand and Ethernet, with multiple FEC options and sub-75ns roundtrip latency for AI/ML applications [7] - Sian2M is designed for low-power short-reach applications, supporting both 800G and 1.6T pluggable modules [11] Availability - Broadcom is currently sampling Sian3 and Sian2M to early access customers, with production of Sian3 expected to ramp in Q3 2025 [9]