Workflow
芯原股份(688521):定增项目获批 公司技术矩阵持续丰富
688521VeriSilicon(688521) 新浪财经·2025-03-26 10:33

Core Viewpoint - The approval of the private placement project will enhance the company's technology matrix and support its growth in key sectors such as AIGC, smart mobility, and graphics processing [1][2]. Fundraising and Project Details - The company plans to raise up to 1.807 billion yuan through a private placement, with funds allocated to two major projects: 1. AIGC and smart mobility Chiplet solution platform development, with a total investment of 1.089 billion yuan over five years [2]. 2. New generation IP development for AIGC and graphics processing, with a total investment of 719 million yuan over five years [2]. Financial Performance and Orders - The company expects a revenue of 2.323 billion yuan in 2024, a slight decrease of 0.66% year-on-year, and a net loss of 605 million yuan, an increase in loss of 309 million yuan year-on-year [3]. - The company has maintained a high order backlog for five consecutive quarters, with an order backlog of 2.406 billion yuan, up nearly 13% from the previous quarter [4]. Market Position and Growth Potential - The implementation of the private placement project is expected to enrich the company's technology matrix and create profit growth points, addressing the demand for high-performance computing chips in the AIGC market [4]. - The company has a diverse product application across various sectors, including consumer electronics, automotive electronics, and data processing, with a strong client base [5]. Revenue Forecast - The revenue forecasts for 2024-2026 are adjusted to 2.323 billion yuan, 2.980 billion yuan, and 3.668 billion yuan, respectively, reflecting a downward revision from previous estimates [5].