定增17.78亿，乐鑫科技谋新局

Core Viewpoint - Lexin Technology plans to raise 1.778 billion yuan through a private placement to fund various projects, including Wi-Fi 7 chip development and RISC-V AI chip research, while also addressing liquidity needs [3][4][6]. Financing Details - Lexin Technology aims to raise 1.778 billion yuan for projects such as Wi-Fi 7 router and terminal chip development, RISC-V AI chip research, and the construction of a Shanghai R&D center, with 100 million yuan allocated for working capital [3][4][9]. - The company previously raised 1.252 billion yuan during its IPO in 2019 [4]. Financial Performance - For 2024, Lexin Technology expects total revenue of 2.007 billion yuan, a year-on-year increase of 40.04%, and a net profit of 340 million yuan, up 149.54% [4][5]. - Key financial metrics show significant growth, including a 217.40% increase in operating profit and a 106.38% rise in basic earnings per share [5]. Market Trends and Opportunities - The demand for IoT devices connected via Wi-Fi is projected to grow from 3.573 billion in 2023 to 4.549 billion by 2030, indicating a robust market for Lexin's products [7]. - The company is focusing on the application of Wi-Fi 7 technology in smart homes, industrial IoT, and smart cities [8]. Strategic Focus - Lexin Technology emphasizes the need for advanced AI processing capabilities in terminal devices, which necessitates the development of flexible RISC-V AI acceleration chips [7][10]. - The company aims to enhance its independence in semiconductor technology, particularly in the context of increasing reliance on domestic IP design and development [10].