USC(SH:688403) Zheng Quan Zhi Xing·2025-04-01 08:24Summary of Key Points Core Viewpoint - The announcement details the conversion results of the convertible bonds issued by Hefei New Huicheng Microelectronics Co., Ltd. for the first quarter of 2025, highlighting the low conversion activity since the bonds began trading in February 2025. Group 1: Convertible Bond Issuance Overview - The company was approved to issue 11,487,000 convertible bonds at a face value of RMB 100 each, raising a total of approximately RMB 1.14 billion [2] - The bonds, named "Huicheng Convertible Bonds," have a conversion period from February 13, 2025, to August 6, 2030, with a conversion price of RMB 7.70 per share [2] Group 2: Conversion Status - As of March 31, 2025, the total amount converted from the "Huicheng Convertible Bonds" was RMB 44,000, resulting in 5,701 shares converted, which is about 0.0007% of the total shares outstanding before conversion [1][2] - The amount of convertible bonds that have not been converted as of March 31, 2025, is RMB 1.148656 billion, representing 99.9962% of the total issuance [1][3] Group 3: Share Capital Changes - The total number of shares before the conversion was 837,976,281, which increased to 837,981,982 after the conversion, reflecting the addition of 5,701 shares [3]